Novel PC miniature board

Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See
{"title":"Novel PC miniature board","authors":"Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See","doi":"10.1109/ICEP.2016.7486900","DOIUrl":null,"url":null,"abstract":"The purpose of this article is to showcase the smallest SoC platform design with 4×2.5 inch board size. You can imagine this board as a name-card size. The main intention of this prototype is to enable a new desktop form factor design based on Intel latest essential platform which is Baytrail-Mobile/Desktop. The board design will incorporate lowest platform power solution, golden hardware that can be used for multiple OS. This prototype is a reference design to ODM/OEM to enable lowest pricing product and accelerate the product into market. This new form factor is appropriate for some channels, Mini PC usage, IoT and embedded application.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2016.7486900","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The purpose of this article is to showcase the smallest SoC platform design with 4×2.5 inch board size. You can imagine this board as a name-card size. The main intention of this prototype is to enable a new desktop form factor design based on Intel latest essential platform which is Baytrail-Mobile/Desktop. The board design will incorporate lowest platform power solution, golden hardware that can be used for multiple OS. This prototype is a reference design to ODM/OEM to enable lowest pricing product and accelerate the product into market. This new form factor is appropriate for some channels, Mini PC usage, IoT and embedded application.
新型PC微型板
本文的目的是展示最小的SoC平台设计4×2.5英寸板尺寸。你可以把这块板想象成名片大小。这个原型的主要目的是实现基于英特尔最新基本平台Baytrail-Mobile/ desktop的新桌面外形设计。该电路板设计将采用最低的平台功耗解决方案,可用于多个操作系统的黄金硬件。此原型是ODM/OEM的参考设计,以实现最低价格的产品并加速产品进入市场。这种新的外形因素适用于某些渠道,迷你PC使用,物联网和嵌入式应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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