H. Kondo, Masaki Yoshida, Munetoshi Kusama, S. Teraki
{"title":"高性能绝缘胶膜，适用于高频应用","authors":"H. Kondo, Masaki Yoshida, Munetoshi Kusama, S. Teraki","doi":"10.1109/ICEP.2016.7486777","DOIUrl":null,"url":null,"abstract":"Recently, continuing growth of highly-functional electronic devices such as wearables is increasing the volume and speed of data transmission and high frequency communication is essential. Thus, device component suppliers must offer products with low transmission loss.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"High performance insulating adhesive film for high-frequency applications\",\"authors\":\"H. Kondo, Masaki Yoshida, Munetoshi Kusama, S. Teraki\",\"doi\":\"10.1109/ICEP.2016.7486777\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently, continuing growth of highly-functional electronic devices such as wearables is increasing the volume and speed of data transmission and high frequency communication is essential. Thus, device component suppliers must offer products with low transmission loss.\",\"PeriodicalId\":343912,\"journal\":{\"name\":\"2016 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEP.2016.7486777\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2016.7486777","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High performance insulating adhesive film for high-frequency applications
Recently, continuing growth of highly-functional electronic devices such as wearables is increasing the volume and speed of data transmission and high frequency communication is essential. Thus, device component suppliers must offer products with low transmission loss.
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