细间距微凸块印刷成型

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI:10.1109/ICEP.2016.7486824

Hiroaki Ikeda, S. Sekine, Ryuji Kimura, Koichi Shimokawa, K. Okada, H. Shindo, T. Ooi, Rei Tamaki, Makoto Nagata

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引用次数: 0

摘要

我们研究了适用于3DIC凹凸成型的印刷技术，包括正面凹凸和背面凹凸。碰撞材料需要几个TSV工艺环境和3DIC堆叠的特点，然后是回流。我们选择了纳米功能材料，它最初是为功率半导体附件开发的。结果显示了良好的可能性。验证了20μm的凹凸间距能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fine pitch micro-bump forming by printing

We have examined printing technology which is adaptable to 3DIC bump-forming for (both front-side bump and back-side bump. The materials for bumping require several features for TSV process circumstances and 3DIC stacking followed by reflow. We chose Nano-Function material for the purpose which was initially developed for power semiconductor attachment. The result shows good possibility. 20μm bump pitch capability was confirmed.

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2016 International Conference on Electronics Packaging (ICEP)

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