Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See
{"title":"新型PC微型板","authors":"Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See","doi":"10.1109/ICEP.2016.7486900","DOIUrl":null,"url":null,"abstract":"The purpose of this article is to showcase the smallest SoC platform design with 4×2.5 inch board size. You can imagine this board as a name-card size. The main intention of this prototype is to enable a new desktop form factor design based on Intel latest essential platform which is Baytrail-Mobile/Desktop. The board design will incorporate lowest platform power solution, golden hardware that can be used for multiple OS. This prototype is a reference design to ODM/OEM to enable lowest pricing product and accelerate the product into market. This new form factor is appropriate for some channels, Mini PC usage, IoT and embedded application.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel PC miniature board\",\"authors\":\"Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See\",\"doi\":\"10.1109/ICEP.2016.7486900\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The purpose of this article is to showcase the smallest SoC platform design with 4×2.5 inch board size. You can imagine this board as a name-card size. The main intention of this prototype is to enable a new desktop form factor design based on Intel latest essential platform which is Baytrail-Mobile/Desktop. The board design will incorporate lowest platform power solution, golden hardware that can be used for multiple OS. This prototype is a reference design to ODM/OEM to enable lowest pricing product and accelerate the product into market. This new form factor is appropriate for some channels, Mini PC usage, IoT and embedded application.\",\"PeriodicalId\":343912,\"journal\":{\"name\":\"2016 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEP.2016.7486900\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2016.7486900","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The purpose of this article is to showcase the smallest SoC platform design with 4×2.5 inch board size. You can imagine this board as a name-card size. The main intention of this prototype is to enable a new desktop form factor design based on Intel latest essential platform which is Baytrail-Mobile/Desktop. The board design will incorporate lowest platform power solution, golden hardware that can be used for multiple OS. This prototype is a reference design to ODM/OEM to enable lowest pricing product and accelerate the product into market. This new form factor is appropriate for some channels, Mini PC usage, IoT and embedded application.
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