27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.最新文献

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Interactive tutoring tool for learning of electronic schemes 电子方案学习互动式辅导工具
P. Manoilov, V. Mateev
{"title":"Interactive tutoring tool for learning of electronic schemes","authors":"P. Manoilov, V. Mateev","doi":"10.1109/ISSE.2004.1490451","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490451","url":null,"abstract":"Multimedia, simulation, computer-mediated communication networks and distance learning have all become part of the educational toolkit. The major technology that changed the face of education was based on the widespread use of artificial intelligence (AI). The artificial intelligence approach uses results from cognitive science to create software with more humanlike abilities, which can help students learn better. An artificial intelligence system for self learning and testing of students' knowledge about electronic circuit design has been presented in this paper. The system can be used in all subjects where schematic diagrams have been included. Java has been used as a powerful programming language for developing platform independent interactive and computational based software that can be used through a Java-enabled Web browser.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122343108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Accelerated reliability growth of electronic devices 电子设备可靠性增长加快
A. Andonova, N. Atanasova
{"title":"Accelerated reliability growth of electronic devices","authors":"A. Andonova, N. Atanasova","doi":"10.1109/ISSE.2004.1490427","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490427","url":null,"abstract":"This paper describes a model for accelerated reliability growth (ARG) analysis. It provides target accelerated test times and aids in the estimation of the expected number of failures for each phase of the subsystem's qualification program. Tools such as Microsoft/spl reg/ Excel are used to program a spreadsheet and graphically display growth curves. An input/output table form is created in this program, and a graphical output is made. An example illustrates the idealized curves for a subsystem using the ARG equations. The MTBF at each point of a test-analyze-and-fix reliability growth phase is shown. After each phase, corrective actions are incorporated into the subsystem, yielding a jump in MTBF. The acceleration factor (AF) is estimated from accelerated conditions and expected typical failure modes.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127987135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Topologically advised terminal assignment of packages in multilayered circuitry 多层电路中封装的拓扑建议终端分配
H.J. Kazgraber
{"title":"Topologically advised terminal assignment of packages in multilayered circuitry","authors":"H.J. Kazgraber","doi":"10.1109/ISSE.2004.1490374","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490374","url":null,"abstract":"We found a situation where we can reduce costs by 50% due to adjusting terminal assignment. As the situation can be found in several technologies, we abstractly look at a \"chip\" on a \"board\". We generalize the \"pinout of the package\" to a system of eight rings of terminal assignment permutations (rotap). By means of the rotaps, it is shown that a randomly done terminal assignment can complicate both the outer layout of the board and the inner layout of the chip. We find topological disentangling having proper models to optimize the terminal assignment. By using cross-edge models, we can gain topological advice while minimizing transformations during modeling work. As a very little, but demonstrative, example, we work out an ASIC, concurrently designed with its dedicated PCB and having terminal assignment optimized. In addition we saved a layer of conductors on the PCB.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"2005 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128803970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
X-ray inspection systems and applications x射线检测系统和应用
R. Kovacs
{"title":"X-ray inspection systems and applications","authors":"R. Kovacs","doi":"10.1109/ISSE.2004.1490368","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490368","url":null,"abstract":"Nowadays, X-ray applications are more and more important for electrical technologies. The ICs are smaller and more complex than before. Area array packages (ball grid array, chip scale package, quad flat pack, and flip chip) are widely used. These devices cover their joints and optical testers are unsuitable for checking them. Only X-ray inspection systems are suitable for checking these hidden joints. The same problem appears in multilayer carriers, where their upper layer hides the inner layers and we can only check them if we can see through the upper layer. Many components have opaque packages and we can see into the package with X-ray systems without destroying it. We can check mechanical devices (for example transformers, relays with plastic package, springs, contacts, etc.) In conclusion, application examples are presented, illustrating how we can use X-ray inspection systems to see through and into the electronic and/or electromechanical structures, and how to check hidden joints, hidden wires, and mechanical devices.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126703946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Stability and reliability of thick film resistors constructed by different techniques 不同工艺制作的厚膜电阻器的稳定性和可靠性
A. Pietrikova, J. Urbančík, S. Slosarcik, M. Bujaloboková, J. Potencki, A. Kolek
{"title":"Stability and reliability of thick film resistors constructed by different techniques","authors":"A. Pietrikova, J. Urbančík, S. Slosarcik, M. Bujaloboková, J. Potencki, A. Kolek","doi":"10.1109/ISSE.2004.1490438","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490438","url":null,"abstract":"Comparison of the stability and reliability of thick film resistors prepared by different techniques is discussed in this work. This aim was accomplished by comparison of the thick film resistors prepared by etching and conventional thick film technology. The etching technique as a combination of three techniques (photolithography, LTCC processing and PCB patterning technology) was introduced for construction of \"planar\" resistors as a new idea. We show that it is possible to develop devices that are useful in standard thick film technology and that it is possible to fabricate 3D (planar) resistors with higher stability and reliability. As operating material we selected low temperature co-fired ceramic (LTCC), because it allows the fabrication of three-dimensional structures, and it is compatible with the screen-printing process.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114067789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Educational platform for modeling of zero-voltage switching quasi-resonant boost converters 零电压开关准谐振升压变换器建模教育平台
S. Lungu, O. Pop, G. Chindris
{"title":"Educational platform for modeling of zero-voltage switching quasi-resonant boost converters","authors":"S. Lungu, O. Pop, G. Chindris","doi":"10.1109/ISSE.2004.1490395","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490395","url":null,"abstract":"This paper presents an educational platform for modeling of basic zero-voltage switching quasi-resonant boost converters using mathematical methods. In order to visualize the results of solving the equations that describe the converter operation, we used Matlab software modules. The advantages of this method of study are: (1) wider availability - it is possible to view the results over the Internet; (2) increased flexibility t is possible to modify any circuit component values, including parasitic components, and study their influence in converter operation, included the time periods affected; (3) it is possible to analyze both half-wave and full-wave operation mode; (4) it is possible to select which operating regimes are displayed, transient or steady-state. The conclusions of the paper allow an objective evaluation of the advantages described above vs. circuit-oriented simulators in the study of quasi-resonant switching mode power supplies. In addition, with an appropriate modeling of each circuit component, this platform allows analyses of component non-idealities (including package models) and their influence on circuit operation.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"58 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114005015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Study of "tanh" ideal and lossy ELIN integrators “tanh”理想和有损ELIN积分器的研究
R. Bozomitu, D. Burdia, V. Cehan
{"title":"Study of \"tanh\" ideal and lossy ELIN integrators","authors":"R. Bozomitu, D. Burdia, V. Cehan","doi":"10.1109/ISSE.2004.1490415","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490415","url":null,"abstract":"The \"tanh\" ideal and lossy ELIN (externally linear, internally nonlinear) integrators as basic building blocks for active filter design are studied. The circuits have been obtained using state-space synthesis and are composed of \"tanh\" and \"sinh/cosh\" blocks which can be implemented in bipolar technology. It is shown that a \"tanh\" ideal ELIN integrator is difficult to use in practice because an appropriate dc equilibrium does not exist. Thus, for the working of such an ELIN system, which realizes the ideal integrator's transfer characteristic, the input dc level must be zero. The problems of dc and low frequency operation can be eliminated by using the \"tanh\" lossy ELIN integrator. The linearity range of the proposed structure depends on the accuracy in which the range of the \"tanh\" transfer characteristics is valid, this being limited (from the existing condition of the input inverse function, \"arctanh\") to the bias current value. Also studied is the unbalance effect of the two bias currents of the nonlinear \"tanh\" transconductance on the \"tanh\" lossy ELIN integrator in dc and ac operation. Finally, the core layout of the \"tanh\" lossy ELIN integrator in 0.8 /spl mu/m BiCMOS technology is presented. The proposed circuit has been simulated in 0.8 /spl mu/m BiCMOS technology showing remarkably good performance, and proving the practical applicability of the proposed structure.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133715742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
White light interferometry, a method for optical 3D-inspection of advanced packages 白光干涉测量法,一种先进包装的光学3d检测方法
M. Schaulin, K. Wolter
{"title":"White light interferometry, a method for optical 3D-inspection of advanced packages","authors":"M. Schaulin, K. Wolter","doi":"10.1109/ISSE.2004.1490373","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490373","url":null,"abstract":"White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123679987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A low-complexity calibration algorithm for current steering DACs 一种低复杂度的电流转向dac标定算法
H. Hristov
{"title":"A low-complexity calibration algorithm for current steering DACs","authors":"H. Hristov","doi":"10.1109/ISSE.2004.1490398","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490398","url":null,"abstract":"The paper presents one possible way of improving both the static and dynamic performance of a current steering digital-to-analog converter (DAC) by calibrating the current sources in the matrix. The method uses a successive approximation register (SAR) and a high resolution current comparator. The current through the least significant bit (LSB) section sets the current of a reference generator which is then used to calibrate the matrix. To avoid the need to subtract current in the process of calibration, the LSB section is purposefully oversized with respect to the MSB section. This greatly simplifies the implementation of the current generation circuitry. The fractional calibration currents are commutated by turning off the respective cascode transistors. As the calibration is intended to take place on command, in order to compensate for temperature and component parameter drift, a dedicated signal is provided to trigger the calibration process. When the cycle is completed, an \"end of conversion\" flag is raised, allowing an easy feedback control of the DAC by an external monitoring system. The paper shows that it is possible to allow a large mismatch of the matrix transistors and still achieve good linearity. Because of the reduced size, dynamic behaviour can be improved as well. Schematic solutions for the main building blocks and simulation results are also presented.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125146231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
How to adapt the electronics packaging teaching process to current needs -a perspective 如何使电子封装教学过程适应当前需求——一个视角
D. Pitica, G. Chindris
{"title":"How to adapt the electronics packaging teaching process to current needs -a perspective","authors":"D. Pitica, G. Chindris","doi":"10.1109/ISSE.2004.1490369","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490369","url":null,"abstract":"The new higher learning educational system in Romanian Universities divided into three main stages of bachelor, master and doctoral degrees demands a new approach which must take into consideration the common ground of different higher learning systems, the specific characteristics of the pre-university learning system and the local particularities of the regional and national electronic industry's environment. A classification of competencies required for the alumni in every stage of education, illustrating the very means of implementing these competencies at the level of electronic packaging education, is proposed. Statistical data results are presented from the training process of the 2002-2003 year of study, where the results were obtained by applying the proposed methods without an effective enrolment in the forthcoming new educational system.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125921871","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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