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27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.最新文献

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Genetic algorithms - synthesis of finite state machines 遗传算法-有限状态机的综合
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490840
Andrey Popov, Krasimira W. Filipova
{"title":"Genetic algorithms - synthesis of finite state machines","authors":"Andrey Popov, Krasimira W. Filipova","doi":"10.1109/ISSE.2004.1490840","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490840","url":null,"abstract":"Genetic algorithms (GAs) are a stochastic, non-derivative optimization method. They use populations of acceptable solutions (genes) of the given problem, which evolve toward optimum. The paper introduces GAs as a method for the synthesis of the activation function of flip-flops in finite state machines. The genes in standard GAs are Boolean vectors. When JK and RS flip-flops are used in the synthesis of finite state machines, there are undefined variables in the activation signals. When the finite state machine is of high order, the Quine-McClusky method is used, which requires exact values of the variables. At this stage, the GAs are used to find the optimal set of variables, in terms of simplifying the description.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125411662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Three-dimensional topography simulation based on a level set method [deposition and etching processes] 基于水平集方法的三维地形模拟[沉积和蚀刻过程]
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490431
A. Sheikholeslami, C. Heitzinger, F. Badrieh, H. Puchner, S. Selberherr
{"title":"Three-dimensional topography simulation based on a level set method [deposition and etching processes]","authors":"A. Sheikholeslami, C. Heitzinger, F. Badrieh, H. Puchner, S. Selberherr","doi":"10.1109/ISSE.2004.1490431","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490431","url":null,"abstract":"We present a general 3D topography simulator for the simulation of deposition and etching processes. The simulator is called ELSA (enhanced level set applications). ELSA is based on a level set method including narrow banding and a fast marching method. Modules for the transport of species, for surface reaction, and for the level set method are its basis.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"287 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132120252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Reliability tests of ultrasonic bonding methods using HAST and THB technology 采用HAST和THB技术的超声粘接方法的可靠性试验
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490419
C. Dominkovics, P. Németh
{"title":"Reliability tests of ultrasonic bonding methods using HAST and THB technology","authors":"C. Dominkovics, P. Németh","doi":"10.1109/ISSE.2004.1490419","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490419","url":null,"abstract":"Reliability is one of the most important questions in any application, on both the package (component) and the board (system) levels. The paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters. It gives a detailed description of the most effective and economical HAST (highly accelerated stress test) and THB (temperature humidity and bias) methods. The paper presents some new results of using HAST and THB technology for the following fields of reliability and life time tests: reliability analysis of assembled SMD passive components; water addition speed tests. Finally, the paper particularly deals with ultrasonic bonding technology, the bonding and testing machines. It introduces some measurement test results on the bonding force before and after a HAST and THB test.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"208 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134060639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Using an embedded microcontroller system to excite vibrating wire transducers 采用嵌入式微控制器系统对振动导线传感器进行激励
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490365
V. Liviu, C. Ioan, D. Mircea, P. Septimiu
{"title":"Using an embedded microcontroller system to excite vibrating wire transducers","authors":"V. Liviu, C. Ioan, D. Mircea, P. Septimiu","doi":"10.1109/ISSE.2004.1490365","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490365","url":null,"abstract":"Vibrating wire transducers are spread all throughout a hydroelectric dam internal structure, grubbed in concrete since the build phase. The transducer includes a piano-like wire mechanically stressed in direct proportion to the measured physical quantity (pressure, displacement, force, etc.). Two electrical coils include the wire in the armature gap, being able either to excite mechanical vibrations or to translate them into electrical signals. A high quality factor oscillator can be built using the ensemble in the feedback path, or successive \"excitation\" and \"listening\" periods can be used. In both cases, the measured frequency represents the physical quantity. The measuring ends are collected, using long connection cables, in some hard-to-reach internal dedicated rooms. Low weight and size portable measuring devices are needed. One of the most at hand solutions is using microcontroller-based units. The paper analyzes possible ways of excitation signal synthesis for different microcontroller families.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134618606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Eddy current losses in round conductors 圆形导体中的涡流损耗
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490425
V. Valchev
{"title":"Eddy current losses in round conductors","authors":"V. Valchev","doi":"10.1109/ISSE.2004.1490425","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490425","url":null,"abstract":"Eddy current losses in round conductors are discussed. An analytical approximation is presented. The proposed solution considers the wire diameter, the number of layers and wires in parallel, the distance from a possible air gap, the horizontal and vertical copper filling factors. The feasible improvements of the design are discussed in order to decrease eddy current losses. The purpose of the paper is to guide the designer to obtain an accurate prediction of eddy current losses in most of the possible winding arrangements, as well as to improve an already made design.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115670313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Measuring modifying impedance transducers 测量修改阻抗传感器
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490366
C. Ioan, D. Mircea, V. Liviu, P. Septimiu
{"title":"Measuring modifying impedance transducers","authors":"C. Ioan, D. Mircea, V. Liviu, P. Septimiu","doi":"10.1109/ISSE.2004.1490366","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490366","url":null,"abstract":"Modifying impedance transducers are often used in hydroelectric building stability monitoring. Structurally, this transducer type includes an LC electronic oscillator, with inductance as variable parameter. The measured physical quantity (pressure, displacement, force, etc.) modifies a geometrical distance, changing the equivalent inductance of the oscillator circuit. In most cases, they are placed far away from the measuring/supply end. As result, the self oscillation frequency is highly influenced by environmental conditions. Long lines add their own inductance to the oscillator equivalent one. The line is noise susceptible, eventually mixing to the oscillator frequency. Important voltage drop reduces the local supply voltage. The useful signal uses the same wire pair as the supply current, so discriminating circuits are required, for both the transducer and the measuring/supply ends. The paper analyzes the power supply, long wire and discriminating circuitry induced errors as well as measuring methods used to minimize them.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"532 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124266408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis and design of active filters with generalized impedance converter 广义阻抗变换器有源滤波器的分析与设计
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490842
A.N. Borodjieva, A. Manukova-Marinova
{"title":"Analysis and design of active filters with generalized impedance converter","authors":"A.N. Borodjieva, A. Manukova-Marinova","doi":"10.1109/ISSE.2004.1490842","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490842","url":null,"abstract":"Studying active filters is a basic composite part of student education in electronics and communication engineering. A methodology for designing active filters with a generalized impedance converter is proposed. Profound investigations of the considered model show that the circuits based on it are some of the lowest sensitivity active sections with great stability and possibilities for realizing high quality factors. Computer simulation with the product MicroCAP is used for investigating different types of active filters obtained on the basis of modifying the main model. These modifications allow low-pass, high-pass, pass-band and stop-band polynomial second-order sections and low-pass and high-pass elliptical second-order sections to be realized. Simulation results are given in tables and in graphical form and can be used in the educational process. Modeling increases the education effectiveness by extending the interests to the studied educational material and improves the motivation of the students.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116028133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Low cost ECG system for non-hazardous use 低成本的心电图系统，无危险使用
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490877
G.K. Petrov
{"title":"Low cost ECG system for non-hazardous use","authors":"G.K. Petrov","doi":"10.1109/ISSE.2004.1490877","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490877","url":null,"abstract":"This article outlines the design and the successful implementation of low frequency digital data acquisition system for non-hazardous medical electro cardiograph (ECG) applications. The concept is based on the requirements for an inexpensive small, reliable and real-time ECG personal computer (PC) based device. The design consists of an ECG analogous sensor block; an analogue to digital converter (ADC) integrated chip (IC) and custom written software for driving, visualization, storing and digital signal processing (DSP) of the acquired ECG data.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"184 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116336971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation of mutual coupling between the resonators in microstrip antenna array 微带天线阵列中谐振腔相互耦合的研究
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490417
N. I. Dodov, N. Stoyanov
{"title":"Investigation of mutual coupling between the resonators in microstrip antenna array","authors":"N. I. Dodov, N. Stoyanov","doi":"10.1109/ISSE.2004.1490417","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490417","url":null,"abstract":"The paper investigates, by simulation, the change of parameters S11 and S13 among three rectangular microstrip resonators in a linear antenna array by changing the distance between them. The middle element is parasitical. This influence is investigated in the E- and H-planes with different values of the parameters (permittivity, /spl epsiv//sub r/, and thickness, h) of the dielectric substrate. In. the next investigation, diagonally placed patches are described. The results and physical processes of the electromagnetic mutual coupling are commented. Besides, they can be used as basic considerations in designing a microstrip antenna array. These results show the influence between two resonators. Besides, they can be used as basic considerations in the design and development of antenna arrays.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129869459","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Thick-film resistors with high negative TCR on alumina and LTCC substrates 在氧化铝和LTCC衬底上具有高负TCR的厚膜电阻
27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI: 10.1109/ISSE.2004.1490380
M. Hrovat, D. Belavic, J. Holc, J. Cilensek, L. Golonka, A. Dziedzic, J. Kita
{"title":"Thick-film resistors with high negative TCR on alumina and LTCC substrates","authors":"M. Hrovat, D. Belavic, J. Holc, J. Cilensek, L. Golonka, A. Dziedzic, J. Kita","doi":"10.1109/ISSE.2004.1490380","DOIUrl":"https://doi.org/10.1109/ISSE.2004.1490380","url":null,"abstract":"The electrical and microstructural characteristics of NTC thick-film resistors, fired either on alumina or cofired on \"green\" LTCC substrates are compared. The NTC resistors, fired on LTCC (as compared to resistors on alumina substrates), have higher sheet resistivities, higher beta factors, and also significantly higher noise indices. SEM and EDX analysis indicated the interaction between NTC and LTCC materials, mainly the diffusion of the glass phase from the LTCC substrate into the NTC resistor.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129912033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
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