基于水平集方法的三维地形模拟[沉积和蚀刻过程]

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI:10.1109/ISSE.2004.1490431

A. Sheikholeslami, C. Heitzinger, F. Badrieh, H. Puchner, S. Selberherr

{"title":"基于水平集方法的三维地形模拟[沉积和蚀刻过程]","authors":"A. Sheikholeslami, C. Heitzinger, F. Badrieh, H. Puchner, S. Selberherr","doi":"10.1109/ISSE.2004.1490431","DOIUrl":null,"url":null,"abstract":"We present a general 3D topography simulator for the simulation of deposition and etching processes. The simulator is called ELSA (enhanced level set applications). ELSA is based on a level set method including narrow banding and a fast marching method. Modules for the transport of species, for surface reaction, and for the level set method are its basis.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"287 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Three-dimensional topography simulation based on a level set method [deposition and etching processes]\",\"authors\":\"A. Sheikholeslami, C. Heitzinger, F. Badrieh, H. Puchner, S. Selberherr\",\"doi\":\"10.1109/ISSE.2004.1490431\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a general 3D topography simulator for the simulation of deposition and etching processes. The simulator is called ELSA (enhanced level set applications). ELSA is based on a level set method including narrow banding and a fast marching method. Modules for the transport of species, for surface reaction, and for the level set method are its basis.\",\"PeriodicalId\":342004,\"journal\":{\"name\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"volume\":\"287 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2004.1490431\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2004.1490431","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

我们提出了一个通用的三维地形模拟器模拟沉积和蚀刻过程。这个模拟器被称为ELSA (enhanced level set applications)。ELSA基于一种水平集方法，包括窄带和快速行进方法。物质输运、表面反应和水平集方法的模块是它的基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Three-dimensional topography simulation based on a level set method [deposition and etching processes]

We present a general 3D topography simulator for the simulation of deposition and etching processes. The simulator is called ELSA (enhanced level set applications). ELSA is based on a level set method including narrow banding and a fast marching method. Modules for the transport of species, for surface reaction, and for the level set method are its basis.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.

自引率

0.00%

发文量