White light interferometry, a method for optical 3D-inspection of advanced packages

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI:10.1109/ISSE.2004.1490373

M. Schaulin, K. Wolter

引用次数: 1

Abstract

White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed.

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白光干涉测量法，一种先进包装的光学3d检测方法

白光干涉法是一种非常精确地获取三维曲面形状的测量方法。本文分析了白光干涉法在先进封装装配过程传感器中的适用性。讨论了该测量方法在区域阵分量测量中的实现和实际应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.

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