2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)最新文献

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Future Prospective of Programmable Logic Non-volatile Device 可编程逻辑非易失性器件的未来展望
C. Hsu
{"title":"Future Prospective of Programmable Logic Non-volatile Device","authors":"C. Hsu","doi":"10.1109/MTDT.2006.16","DOIUrl":"https://doi.org/10.1109/MTDT.2006.16","url":null,"abstract":"Non-Volatile Memory devices are indispensable for embedded chip/system. They are used for the storage of embedded software, which controls the operation of the chip/system. Conventionally, to embed Non-Volatile Memory devices onto a chip requires tremendous effort to develop a processing technology, which incorporates Non-Volatile Memory devices with logic devices. However, such effort requires more masking layers to be added to the logic process and thus the cost and turn around time of manufacturing considerably increases. The programmable logic Non-Volatile devices (Neobit®/NeoFlash®) offered by eMemory uses the exiting processes (Logic, Analog, Mixed-Mode, RF, HV, etc.) without or with minimum extra cost (2 additional non-critical masking layers). Neobit®/NeoFlash® offers cost-effective and fast development cycled programmable logic Non- Volatile devices to be used in embedded chip/system. Due to its simplicity and high portability, it is believed that such solutions will enable the increased applications of embedded system and over 90% of embedded chip will use programmable logic Non-Volatile device by 2010. Programmable logic Non-Volatile device become very promising in various semiconductor applications.","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125263476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
New on-Chip DFT and ATE Features for Efficient Embedded Memory Test 新的片上DFT和ATE功能用于高效嵌入式存储器测试
P. Muhmenthaler
{"title":"New on-Chip DFT and ATE Features for Efficient Embedded Memory Test","authors":"P. Muhmenthaler","doi":"10.1109/MTDT.2006.20","DOIUrl":"https://doi.org/10.1109/MTDT.2006.20","url":null,"abstract":"Testing of embedded memories, independent whether it is of volatile or non-volatile type, is based on various kinds of built-in self-test. This test solution is often driven by the fact that the system application does not provide an atspeed signal interface at the product pins. In complex SoC designs it is furthermore mandatory to do BIST as there are multiple memories of various size and organization integrated onto one chip. Given the fact that multi-site testing is state of the art even for highly complex SoCs the requirements onto the available test equipment (ATE) depend on the selection whether the product is dominated by memory or by logic/mixed signal or RF functions. This often leads to less efficient test solutions and requires multi insertion test flows in production. Here a new approach will be presented to bridge this challenging scenario. It contains a new type of signal and information handling interface between the device under test and the tester. The revolutionary change is that the ATE will act in a slave mode during a significant fraction of the manufacturing test while the DUT controls timing as well as data flow. Such new interface can serve the needs for data collection with focus on diagnosis (scan test diagnosis) at volume manufacturing as well as the complex handling of fail bit data at zero test time overhead. The basic building blocks either on-chip or in the ATE instrumentation will be explained. Especially in testing multiple embedded memories on multiple chips at the same time the throughput increase will be extraordinary.","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128637894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment 基于顶层金属分配的不同通孔层可编程的FlexiVia ROM编译器
D. Kwai, Yung-Fa Chou, Meng-Fan Chang, Su-Meng Yang, Ding-Sheng Chen, M. Hsu, Yu-Zhen Liao, S. Lin, Yu-Ling Sung, Chia-Hsin Lee, Hsin-Kun Hsu
{"title":"FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment","authors":"D. Kwai, Yung-Fa Chou, Meng-Fan Chang, Su-Meng Yang, Ding-Sheng Chen, M. Hsu, Yu-Zhen Liao, S. Lin, Yu-Ling Sung, Chia-Hsin Lee, Hsin-Kun Hsu","doi":"10.1109/MTDT.2006.14","DOIUrl":"https://doi.org/10.1109/MTDT.2006.14","url":null,"abstract":"We present a ROM compiler programmable from via 1 to via n - 2, where n is the number of metal layers. The layer on which the code via is landed can be selected by the user. With the coding being able to take place as close to the topmost metal as possible, the turnaround time for a revision is shortened. In this paper, we discuss the array assembly scheme and its impacts on the design considerations by the choice of strapping period","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127692967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A March-based algorithm for location and full diagnosis of all unlinked static faults 一种基于march的非链接静态故障定位和全面诊断算法
T. A. Gyonjyan, Gurgen Harutunyan, V. Vardanian
{"title":"A March-based algorithm for location and full diagnosis of all unlinked static faults","authors":"T. A. Gyonjyan, Gurgen Harutunyan, V. Vardanian","doi":"10.1109/MTDT.2006.5","DOIUrl":"https://doi.org/10.1109/MTDT.2006.5","url":null,"abstract":"A new March-based fault location and full diagnosis algorithm is proposed for word-oriented static RAMs. A March algorithm of complexity 31N, N is the number of memory words, is defined for fault detection and partial diagnosis. Then March-like algorithms of complexity 3N to 5N are used to locate the aggressor words of coupling faults (CF) and achieve full diagnosis for all unlinked static CFs. Another March-like algorithm of complexity 16logB+18, B is the number of bits in the word, is applied to locate the aggressor bit in the aggressor word. A software tool is developed for automated generation of fault syndromes for detection, partial and full diagnosis of all static unlinked faults","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124884229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
DRAM Industry Trend DRAM产业趋势
P. Pai
{"title":"DRAM Industry Trend","authors":"P. Pai","doi":"10.1109/MTDT.2006.11","DOIUrl":"https://doi.org/10.1109/MTDT.2006.11","url":null,"abstract":"This presentation starts with DRAM market overview, demand side DRAM bit shipment, content per box trend, followed by the DRAM density migration and the technology migration trend, including process migration, from micrometer to nanometer technology. As technology advances, 300mm fabrication and new generation products become the centerpiece of the future development of the DRAM industry. We present here worldwide 300mm capacity development forecast and the transition of DDR, DDR2, and DDR3, with a brief introduction of DDR3 features and advantages. Then we summarize the demand and supply trend of the DRAM industry. Finally, we conclude our presentation with the historical DRAM cell development and the comparison between Trench and Stack technologies.","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132775783","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel memory organization and circuit designs for efficient data access in applications of 3D graphics and multimedia coding 三维图形和多媒体编码应用中有效数据访问的新颖存储组织和电路设计
Shen-Fu Hsiao, Yonghao Chen, Ming-Yu Tsai, Tze-Chong Cheng
{"title":"Novel memory organization and circuit designs for efficient data access in applications of 3D graphics and multimedia coding","authors":"Shen-Fu Hsiao, Yonghao Chen, Ming-Yu Tsai, Tze-Chong Cheng","doi":"10.1109/MTDT.2006.22","DOIUrl":"https://doi.org/10.1109/MTDT.2006.22","url":null,"abstract":"Memory has become one of the critical components in many applications. This paper presents new designs of SRAM memory circuit and architectures for applications in 3D graphics, JPEG2000, and multimedia codec. In the 3D graphics pipeline, the memory initialization is realized by modifying the circuits in the SRAM decoder and storage cell. In the bit-plane coder (BPC) of JPEG2000, we propose a new 3D memory architecture design and the corresponding circuit designs for efficient data access in processing the stripe-based bit planes. The 3D memory design can be also applied to the design of parallel-in-parallel-out transpose memory that is frequently encountered in the design of 2D DCT in JPEG and MPEG codec. We also develop a memory generator to allow for easy generation of the application-specific memory units of various sizes to be embedded in conventional cell-based design flow","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"409 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124348389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
DDR2 DRAM output timing optimization DDR2 DRAM输出时序优化
J. Vollrath, J. Schwizer, Marcin Gnat, Ralf Schneider, Bret Johnson
{"title":"DDR2 DRAM output timing optimization","authors":"J. Vollrath, J. Schwizer, Marcin Gnat, Ralf Schneider, Bret Johnson","doi":"10.1109/MTDT.2006.9","DOIUrl":"https://doi.org/10.1109/MTDT.2006.9","url":null,"abstract":"The speed of DRAMs is increasing from generation to generation. This paper gives an overview of typical DRAM output timing challenges. Tight output timing specifications in the order of several 100ps are presented. Specification requirements lead to efforts to improve the output driver design. A systematic test strategy evaluates limits of automatic test equipment (ATE) overall timing accuracy (OTA) and device performance. Systematic output timing characterization data leads to guidelines for design improvements. A good characterization strategy gives a feedback to the design of specific weaknesses of output drivers and enables ATEs to test these parameters with high accuracy","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114257604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
MRAM write error categorization with QCKBD 用QCKBD对MRAM写错误进行分类
Y. Shimizu, H. Aikawa, K. Hosotani, N. Shimomura, T. Kai, Y. Ueda, Y. Asao, Y. Iwata, K. Tsuchida, S. Ikegawa
{"title":"MRAM write error categorization with QCKBD","authors":"Y. Shimizu, H. Aikawa, K. Hosotani, N. Shimomura, T. Kai, Y. Ueda, Y. Asao, Y. Iwata, K. Tsuchida, S. Ikegawa","doi":"10.1109/MTDT.2006.19","DOIUrl":"https://doi.org/10.1109/MTDT.2006.19","url":null,"abstract":"A new test pattern, quadruplet checker board (QCKBD), is proposed which enables to evaluate magnetic crosstalk from the neighbor write lines. At first, some conventional test patterns changing the write points were applied to categorize magnetic random access memory (MRAM) write errors. But magnetic crosstalk from the neighbor write lines could not be isolated by these conventional tests since magnetic crosstalk error was caused when the neighbor cell is written. Whereas the QCKBD results from 4Kb test vehicles show that magnetic crosstalk restricts the write margin. By changing the cell structure in order to suppress magnetic crosstalk, the write margin is improved from 3.3 to 7.3","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130215629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A new 1T DRAM cell with enhanced floating body effect 一种新型1T DRAM电池,具有增强的浮体效应
Jyi-Tsong Lin, M. Chang
{"title":"A new 1T DRAM cell with enhanced floating body effect","authors":"Jyi-Tsong Lin, M. Chang","doi":"10.1109/MTDT.2006.6","DOIUrl":"https://doi.org/10.1109/MTDT.2006.6","url":null,"abstract":"Recently the semiconductor industry tends to develop a smaller volume device and system with lower power consumption, lower leakage current, and high speed performance. SOI technology has many unique characteristics, which is one of the most promising methods to the direction. As the semiconductor memory is concerned, the 1T-DRAM cell realized by the concept of floating body effect in a PD-SOI nMOSFET can allow the DRAM cell to be scaled down in depth with less area occupied. In this paper, we propose a new structure of 1T-DRAM cell, which has bottom buried oxide with the sidewall block oxide around its body, which can suppress the leakage current between the S/D and the body of the cell. In addition it can also improve the programming window of the 1T-DRAM cell more than 39% by utilizing its own structural characteristic","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130040423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Improved representatives for unrepairability judging and economic repair solutions of memories 改进了记忆的不可修复性判断和经济修复方案
Hsing-Chung Liang, LeeAnn Tzeng
{"title":"Improved representatives for unrepairability judging and economic repair solutions of memories","authors":"Hsing-Chung Liang, LeeAnn Tzeng","doi":"10.1109/MTDT.2006.18","DOIUrl":"https://doi.org/10.1109/MTDT.2006.18","url":null,"abstract":"This paper introduces a novel procedure of identifying better representatives of faulty cells in a memory map to help judge unrepair ability and provide economic repair recommendation. These representative faulty cells, called leading elements (LE), are classified into four primary types based on their characteristics. Three specific pairs of initially identified LE are extracted for further operations, which are replacing certain LE with other better representatives and assigning the cross point faults between two certain LE as new LE. All steps of the procedure are analyzed in sequence with verification, clearly indicating that the identified LE represent both the more exact thresholds for judging unrepairability and usually the most economic repair solutions. Experiments on many example maps show that the procedure can be fast in searching 7% more LE and be applicable to accumulate data for redundancy planning afterwards","PeriodicalId":320365,"journal":{"name":"2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121807741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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