DRAM产业趋势

P. Pai
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引用次数: 0

摘要

本演讲以DRAM市场概述、需求端DRAM位出货量、每盒内容趋势开始,然后是DRAM密度迁移和技术迁移趋势,包括从微米到纳米技术的工艺迁移。随着技术的进步,300mm制程和新一代产品将成为DRAM产业未来发展的核心。本文介绍了全球300mm产能发展预测及DDR、DDR2、DDR3的过渡,并简要介绍了DDR3的特点和优势。然后总结了DRAM行业的供需趋势。最后,我们总结了DRAM单元的历史发展以及Trench和Stack技术的比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DRAM Industry Trend
This presentation starts with DRAM market overview, demand side DRAM bit shipment, content per box trend, followed by the DRAM density migration and the technology migration trend, including process migration, from micrometer to nanometer technology. As technology advances, 300mm fabrication and new generation products become the centerpiece of the future development of the DRAM industry. We present here worldwide 300mm capacity development forecast and the transition of DDR, DDR2, and DDR3, with a brief introduction of DDR3 features and advantages. Then we summarize the demand and supply trend of the DRAM industry. Finally, we conclude our presentation with the historical DRAM cell development and the comparison between Trench and Stack technologies.
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