基于顶层金属分配的不同通孔层可编程的FlexiVia ROM编译器

D. Kwai, Yung-Fa Chou, Meng-Fan Chang, Su-Meng Yang, Ding-Sheng Chen, M. Hsu, Yu-Zhen Liao, S. Lin, Yu-Ling Sung, Chia-Hsin Lee, Hsin-Kun Hsu
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引用次数: 0

摘要

我们提出了一种可编程的ROM编译器,从通过1到通过n - 2,其中n是金属层数。用户可以选择放置代码通道的层。由于编码能够尽可能靠近最上层的金属,因此修订的周转时间缩短了。本文从捆扎周期的选择出发,讨论了阵列的装配方案及其对设计考虑的影响
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment
We present a ROM compiler programmable from via 1 to via n - 2, where n is the number of metal layers. The layer on which the code via is landed can be selected by the user. With the coding being able to take place as close to the topmost metal as possible, the turnaround time for a revision is shortened. In this paper, we discuss the array assembly scheme and its impacts on the design considerations by the choice of strapping period
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