2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第10页

A parametric multilevel MEMS simulation methodology using finite element method and mesh morphing 基于有限元法和网格变形的参数化多电平微机电系统仿真方法

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191776

V. Kolchuzhin, J. Mehner

引用次数: 2

Combined creep and fatigue measurement method for lead-free solder alloys 无铅钎料合金蠕变和疲劳联合测量方法

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191735

R. Metasch, M. Roellig, K. Wolter

引用次数: 0

2D finite elements electro-thermal modeling for IGBT: Uni and multicellular approach IGBT的二维有限元电热建模:单胞和多胞方法

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191757

K. El boubkari, S. Azzopardi, L. Théolier, J. Delétage, E. Woirgard

引用次数: 7

Evaluation of very low bending radius of flexible circuits beyond the standard design rules 超出标准设计规则的柔性电路极低弯曲半径的评价

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191716

W. M. Filho, S. Hameau, M. Brizoux

引用次数: 1

Thermal and moisture degradation in SSL system SSL系统的热湿降解

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191806

S. Koh, W. Driel, G. Zhang

{"title":"Thermal and moisture degradation in SSL system","authors":"S. Koh, W. Driel, G. Zhang","doi":"10.1109/ESIME.2012.6191806","DOIUrl":"https://doi.org/10.1109/ESIME.2012.6191806","url":null,"abstract":"Currently, most of the SSL research on SSL's failure is based on thermal induced failure. This is insufficient as application such as outdoor street lighting and automotive headlights are exposed to both high humidity and temperature. This will induced additional hygroscopic stress which may induced further degradation of the SSL system. However, there is only limited studies in the literature that investigates the effect of the degradation of SSL's life due to the hygroscopic stress degradation. This is because the current thermal moisture methodology for computing combine hygroscopic and thermal stress is only limited to linear elastic analysis where linear superposition is value. In this research, numerical analysis capable of modeling nonlinear thermal and hygroscopic effect has been developed. Using this method, this paper will compare the failure of light emitting diode due to thermal mechanical with or without the additional hygroscopic stresses. This is also important since accelerated testing using increase temperature may not be sufficient due to the very narrow temperature range that it can be used to perform a valid test. Hence, by understand hygroscopic stresses induced failure in solder layer; it may enable another parameter to increases the accelerated factors during these tests.","PeriodicalId":319207,"journal":{"name":"2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127666500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Molecularly derived mesoscale modeling of an epoxy/Cu interface (part III*): Interface roughness 环氧/Cu界面的分子衍生中尺度模拟(第三部分*):界面粗糙度

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191702

N. Iwamoto

引用次数: 4

Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging 电子封装中焊点复合加载与失效模式分析实验系统

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191743

K. Jankowski, A. Wymyslowski, D. Chicot

{"title":"Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging","authors":"K. Jankowski, A. Wymyslowski, D. Chicot","doi":"10.1109/ESIME.2012.6191743","DOIUrl":"https://doi.org/10.1109/ESIME.2012.6191743","url":null,"abstract":"Reliability of solder joints plays a major role in the electronic packaging. Indeed, the solder joints serve not only for the transmitting of electrical signals, but also for the heat transportation and as a structural support which is one of the most important aspects. Keeping of all these features is extremely difficult, due to different thermo-mechanical loadings, which cause slow degradation of the joints in the process of time. This paper will present preliminary results concerning an experimental method for testing the reliability of solder joints. This original method allows the precise separation of the selected degradation factors due to creep and fatigue. For this purpose the experimental setup and corresponding device (FRIS) have been developed and manufactured including displacement sensor of the micrometer order, which is mounted directly at the test sample. This allows both the measurement of the sample displacement submitted to two types of external thermomechanical loadings: - Creep resulting of constant loading applied over a long period of time, - Fatigue resulting from multicyclic loading. Additionally it is planned the application of these two types of loading in a form of a combined load in order to analyse and verify the influence of damage accumulation due to creep and fatigue solicitations on the solder joint behaviour. The above will be as well analysed by an appropriate FEM numerical modelling and simulation techniques.","PeriodicalId":319207,"journal":{"name":"2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114788818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Lifetime assessment of BGA solder joints with voids under thermo-mechanical load 热机械载荷下带孔洞的BGA焊点寿命评估

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191756

R. Schwerz, M. Roellig, K. Meier, K. Wolter

引用次数: 3

Study of an active thermal recovery mechanism for an electrostatically actuated RF-MEMS switch 静电驱动RF-MEMS开关的主动热回收机制研究

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191766

T. Kuenzig, J. Iannacci, G. Schrag, G. Wachutka

引用次数: 21

The method of lines for the analysis of mechanical structures 用直线法分析机械结构

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191784

A. Taghavi, L. Vietzorreck

引用次数: 0