2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - 最新文献

Establishing the interfacial fracture properties of Cu-EMC interfaces at harsh condition

Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191739 M. Sadeghinia, K. Jansen, L. Ernst, H. Pape

Influence of conversion level on simulation results of crosslinked polymers

Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191759 S. Tesarski, A. Wymyslowski, O. Holck

Failure modeling of BGA package for reliability evaluation of handheld products under drop event

Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191799 Soonwan Chung, J. Kwak, Seunghee Oh, Changsun Kang
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