{"title":"Combined creep and fatigue measurement method for lead-free solder alloys","authors":"R. Metasch, M. Roellig, K. Wolter","doi":"10.1109/ESIME.2012.6191735","DOIUrl":null,"url":null,"abstract":"This work studies the secondary creep behaviour at approx. 25% stress drop in the fatigue curve on bulk solder specimens in a tensile and compression experiment. With the adaption of the pre-factor of the secondary creep models the acceleration is describable. To get a good correlation between the model as well as the real tensile and compression experiments, advanced modelling with primary and tertiary creep will be necessary.","PeriodicalId":319207,"journal":{"name":"2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"327 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2012.6191735","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This work studies the secondary creep behaviour at approx. 25% stress drop in the fatigue curve on bulk solder specimens in a tensile and compression experiment. With the adaption of the pre-factor of the secondary creep models the acceleration is describable. To get a good correlation between the model as well as the real tensile and compression experiments, advanced modelling with primary and tertiary creep will be necessary.