2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems最新文献_第5页

Optimized coplanar waveguides in membrane technology for wideband on-wafer calibrations 优化共面波导的膜技术，用于宽带片上校准

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100191

U. Arz, M. Rohland, K. Kuhlmann, S. Buttgenbach

引用次数: 5

System design considerations for a 5Gb/s source-synchronous link with common-mode clocking 具有共模时钟的5Gb/s源同步链路的系统设计考虑

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100210

Jihong Ren, D. Oh, R. Kollipara, Brian Tsang, Yue Lu, J. Zerbe, Qi Lin

引用次数: 1

Latency insertion method (LIM) for CMOS circuit simulations with multi-rate considerations 多速率CMOS电路仿真的延迟插入法(LIM)

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100205

P. Goh, J. Schutt-Ainé

引用次数: 11

Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-Droop and resonant noise in 3DIC 基于tsv的分层配电网络一阶下垂和谐振噪声估计分析与方法

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100243

G. Charles, P. Franzon, Jaemin Kim, Alex Levin

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引用次数: 2

Interconnect transient simulation in the presence of layout and routing uncertainty 存在布局和路由不确定性的互连暂态仿真

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100214

A. Rong, A. Cangellaris

引用次数: 28

A comparison of two latency insertion methods in dependent sources applications 依赖源应用程序中两种延迟插入方法的比较

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100250

Ping Liu, Jilin Tan, Zhongyong Zhou, J. Schutt-Ainé, P. Goh

引用次数: 1

Optimal decoupling capacitors design for suppressing edge radiation of power/ground planes 抑制电源/地平面边缘辐射的最佳去耦电容器设计

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100247

Kuan-Wei Li, K. Wu, R. Wu

引用次数: 4

A fine-grained co-simulation methodology for IR-drop noise in silicon interposer and TSV-based 3D IC 硅中间体和基于tsv的3D集成电路中ir降噪声的细粒度联合模拟方法

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100236

Taigon Song, S. Lim

引用次数: 7

A new method to estimate phases of sinusoidal jitter to evaluate high-speed links 一种估计高速链路正弦抖动相位的新方法

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100233

Yu Chang, C. Madden, R. Schmitt

引用次数: 0

Waveform relaxation and overlapping partitioning techniques for tightly coupled interconnects 紧耦合互连的波形松弛和重叠划分技术

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100201

M. Farhan, N. Nakhla, M. Nakhla, R. Achar, Albert Ruehliy

引用次数: 1