2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems最新文献

High-frequency through-silicon Via (TSV) failure analysis 高频硅通孔(TSV)失效分析

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100237

Joohee Kim, Jonghyun Cho, J. Pak, Joungho Kim, J. Yook, J. C. Kim

引用次数: 17

Early stage chip/package/board co-design techniques for system-on-chip 片上系统的早期芯片/封装/板协同设计技术

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100175

M. Tanaka, M. Toyama, Ryo Mori, H. Nakashima, M. Haida, I. Ooshima

引用次数: 7

SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers 可感知si的布局和均衡器设计，以提高刀片服务器中高速链路的性能

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100226

Yung-Shou Cheng, Hsin-Hung Lu, Michael Chang, Stephen Chang, Bob Liu, R. Wu

引用次数: 5

Reduced circuit modeling of mother board and package for a system power delivery analysis 简化母板和封装的电路建模，用于系统功率传递分析

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100241

Jayong Koo, V. Pandit

引用次数: 5

Macromodeling based variability analysis of an inverted embedded microstrip line 基于宏建模的反向嵌入式微带线变异性分析

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100213

Dries Vante Ginste, D. De Zutter, D. Deschrijver, T. Dhaene, F. Canavero

引用次数: 10

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling 采用模态信号设计用于不连续高密度链路的12Gb/s收发器

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100230

P. Milosevic, J. Schutt-Ainé

引用次数: 6

High-speed performance of Silicon Bridge die-to-die interconnects 硅桥模对模互连的高速性能

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100196

H. Braunisch, A. Aleksov, S. Lotz, J. Swan

引用次数: 23

Verification of novel technology for power integrity on 16-channel 3Gbps circuit boards 16通道3Gbps电路板电源完整性新技术验证

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100172

Norifumi Sasaoka, Takafumi Ochi, Y. Akiyama, K. Kono, C. Ueda, K. Otsuka

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引用次数: 2

Alternative SPICE implementation of circuit uncertainties based on orthogonal polynomials 基于正交多项式的电路不确定性的替代SPICE实现

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100181

P. Manfredi, I. Stievano, F. Canavero

引用次数: 15

Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance 采用基于局部电容的积分方程法计算共享反垫结构的电容

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100244

Hanfeng Wang, A. Ruehli, J. Fan

引用次数: 6