Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance

Hanfeng Wang, A. Ruehli, J. Fan
{"title":"Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance","authors":"Hanfeng Wang, A. Ruehli, J. Fan","doi":"10.1109/EPEPS.2011.6100244","DOIUrl":null,"url":null,"abstract":"An integral equation method used for capacitance extraction for axially symmetric geometries is extended in this paper to calculate the via-plane capacitances in shared-antipad via structures, by changing the circular ring cells to arc ones. The proposed method is validated with a commercial finite element method based tool for a typical structure used in modern high-speed printed circuit design.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100244","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

An integral equation method used for capacitance extraction for axially symmetric geometries is extended in this paper to calculate the via-plane capacitances in shared-antipad via structures, by changing the circular ring cells to arc ones. The proposed method is validated with a commercial finite element method based tool for a typical structure used in modern high-speed printed circuit design.
采用基于局部电容的积分方程法计算共享反垫结构的电容
本文将用于轴对称几何的电容提取的积分方程方法推广到通过将环形单元改为圆弧单元来计算共享反衬垫结构的过面电容。以现代高速印刷电路设计中的典型结构为例,利用基于有限元方法的商用工具对所提出的方法进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信