采用基于局部电容的积分方程法计算共享反垫结构的电容

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI:10.1109/EPEPS.2011.6100244

Hanfeng Wang, A. Ruehli, J. Fan

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引用次数: 6

摘要

本文将用于轴对称几何的电容提取的积分方程方法推广到通过将环形单元改为圆弧单元来计算共享反衬垫结构的过面电容。以现代高速印刷电路设计中的典型结构为例，利用基于有限元方法的商用工具对所提出的方法进行了验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance

An integral equation method used for capacitance extraction for axially symmetric geometries is extended in this paper to calculate the via-plane capacitances in shared-antipad via structures, by changing the circular ring cells to arc ones. The proposed method is validated with a commercial finite element method based tool for a typical structure used in modern high-speed printed circuit design.

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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

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