{"title":"Charging on resist-patterned wafers during high-current ion implants","authors":"W. Lukaszek, S. Daryanani, J. Shields","doi":"10.1109/IIT.2002.1257975","DOIUrl":"https://doi.org/10.1109/IIT.2002.1257975","url":null,"abstract":"Charging characteristics of As+ and BF2+ high-current ion implants were measured using bare and resist-covered CHARM®-2 wafers patterned with a six-field mask containing holes ranging from 2 μm to 0.5 μm (as well as clear and resist-covered fields). The results show surprising differences in the charging characteristics of high-current ion implanters compared to contemporary plasma-based process tools. In plasma tools, the electron-shading\"\" effects increase positive (and decrease negative) potentials and current densities as hole size decreases. On the contrary, high-current ion implants exhibited positive and negative potentials independent of hole size. The positive and negative current densities were also independent of hole size (but significantly higher than in the clear field). These results indicate that charging damage in high-current ion implanters should not increase when implant mask features are scaled down (other factors being equal). We also explain the apparent absence of damage in contemporary high-current ion implanters in spite of the very high positive current densities and high positive potentials.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"197 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122542929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Cesca, A. Gasparotto, B. Fraboni, F. Priolo, E. C. Moreira, G. Scamarcio
{"title":"Optical properties and applications of heavily Fe implanted InP","authors":"T. Cesca, A. Gasparotto, B. Fraboni, F. Priolo, E. C. Moreira, G. Scamarcio","doi":"10.1109/IIT.2002.1258090","DOIUrl":"https://doi.org/10.1109/IIT.2002.1258090","url":null,"abstract":"Different Fe implantation schemes in n-doped InP have been used in order to create semi-insulating layers with the desired characteristics. The electrical properties of these structures have been investigated by means of current-voltage measurements and deep level analyses; compensation of n-doping up to 1019 cm-3 has been verified. Electroluminescence emission has also been obtained from the compensated samples with the highest substrate doping concentration up to the temperature of 260 K.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114153795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Investigation of indium activation by SRP and SIMS for sub-0.1 μm retrograde channels","authors":"A. Suvkhanov, M. Mirabedini, V. Hornback","doi":"10.1109/IIT.2002.1257930","DOIUrl":"https://doi.org/10.1109/IIT.2002.1257930","url":null,"abstract":"SRP, SIMS and C-V measurements of implanted Si wafers were carried out in this study to examine the effect of annealing conditions on the activation of acceptors. Shorter RTP annealing at relatively low temperatures provided higher Indium activation levels as determined by Rs measurements. The influence of the implantation sequence (In+B and B+In) on the dopant distribution was also investigated. The In+B implantation sequence yielded shallower profiles than the B+In implantation. It can be suggested that Indium implantation provides efficient pre-amorphization condition for Boron implantation. Device data for some of these conditions were obtained and the influence of RTP anneal on device performance was critically reviewed.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114494045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Maeno, Y. Ando, Y. Inouchi, H. Tanaka, M. Naito
{"title":"Development of DC-PFG for a large size ion beam in ion doping system","authors":"S. Maeno, Y. Ando, Y. Inouchi, H. Tanaka, M. Naito","doi":"10.1109/IIT.2002.1258001","DOIUrl":"https://doi.org/10.1109/IIT.2002.1258001","url":null,"abstract":"A compact DC-plasma flood gun (DC-PFG) producing (50 mA) electron flux was developed for neutralization of a large size ion beam in doping process of flat panel displays (FPD). To produce the high current electron flux, this PFG contains a multi-cusp type arc chamber with a tungsten filament cathode, single hole to extract the electron and a drift tube with an axial magnetic field to send the electron into ion beam. The PFG doesn't have any gas feeding but dopant gas flowing-in from an ion source for the ion beam formation. A real time measurement system of charge-up voltages on the FPD glass sheets in the midst of doping process was also developed. It adopts some thin film electrodes on the backside surface of glass sheet for voltage sensing. Using this system and additional electrostatic probes, it was concluded that the compact PFG could neutralize the large size ion beam and reduce the charge-up on the FPD glass sheets.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117325152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Mefo, K. Kirkby, B. Sealy, G. Boudreault, C. Jeynes, E.J.H. Collart
{"title":"Elemental analysis of residual deposits in an ion implanter using IBA techniques","authors":"J. Mefo, K. Kirkby, B. Sealy, G. Boudreault, C. Jeynes, E.J.H. Collart","doi":"10.1109/IIT.2002.1258042","DOIUrl":"https://doi.org/10.1109/IIT.2002.1258042","url":null,"abstract":"Fluorinated species are now widely used as source gases in advanced ion implantation systems because of their controllability and relative ease of operation. The extreme reactivity of fluorine can have a deleterious effect on the source and extraction region, leading to the formation of deposits, which in turn can either directly or indirectly compromise the performance of the source. Little is known, however, about the composition of these deposits and the mechanisms by which they are formed. It is for this reason that this study was undertaken. Similar effects are not observed for hydrogenated species such as arsine and phosphine. In this work, BF3 was used as the source gas. The behaviour of the source was monitored, during 25 hours of operation. The deposits resulting from extracting an ion beam were studied using a range of ion beam analysis techniques in conjunction with Scanning Electron Microscopy. It was found that the deposits have a matrix of carbon and the two sides of the deposits show different elemental profiles (W, As, Fe, In, Sb, As), reflecting both the history of the ion implanter and the way in which the deposits were formed.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129693103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimisation of large beam mass analysis","authors":"D. Aitken","doi":"10.1109/IIT.2002.1258037","DOIUrl":"https://doi.org/10.1109/IIT.2002.1258037","url":null,"abstract":"A large beam mass analysis system for both the high current implant of wafers over a very wide energy range (100 eV-100 keV) and/or the implant of large substrates (up to 1 metre) is described. The advantages of the sextupole geometry for the prevention of light ion beam reflection and the intrinsic insensitivity of this technique to beam quality are emphasised.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124563864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Stuber, Soo-Chul Jang Soo-Chul Jang, Wang-Kuen Kim Wang-Kuen Kim
{"title":"Ion implant requirements for high volume DRAM manufacturing","authors":"A. Stuber, Soo-Chul Jang Soo-Chul Jang, Wang-Kuen Kim Wang-Kuen Kim","doi":"10.1109/IIT.2002.1257962","DOIUrl":"https://doi.org/10.1109/IIT.2002.1257962","url":null,"abstract":"Samsung sees Ion Implant technologies as a core competency, i.e. it can only negatively impact device performance or fab productivity. Ion Implant is not viewed as a technology driver for mainstream DRAM devices, like Photolithography and the Plasma Etch technologies. As a leader in the very competitive worldwide Memory market, Samsung utilizes proven implant processes whenever possible. All current memory products utilize a twin retrograde well process. The implant requirements for 0.15 to 0.10 micron DRAM products can easily be met by equipment from any of the major Ion Implant equipment suppliers. The differentiator between any of the implant tools from Samsung's perspective is tool uptime, productivity, and reliability. Samsung has a number of internal and external processes to continuously improve these items. This paper will discuss some of the Samsung ion implant requirements and future trends.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129476261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Agarwal, B. Stevenson, M. Ameen, B. Freer, J. Poate
{"title":"Molecular n-type dopant implants","authors":"A. Agarwal, B. Stevenson, M. Ameen, B. Freer, J. Poate","doi":"10.1109/IIT.2002.1257953","DOIUrl":"https://doi.org/10.1109/IIT.2002.1257953","url":null,"abstract":"The use of dimer As<sub>2</sub><sup>+</sup> or P<sub>2</sub><sup>+</sup> ions at ultra-low energies can lead to substantial throughput advantages compared with the use of monomer As<sup>+</sup> or P<sup>+</sup> ions. Here we investigate the differences in the as-implanted damage from dimer and monomer ions using high resolution Rutherford backscattering and Thermawave measurements. Use of dimer ions leads to more damage as revealed by the formation of a thicker amorphous layer than from monomer ions. The amorphization threshold for 3-keV As<sup>+</sup> is found to be between 0.5 and 1×10<sup>14</sup> cm<sup>-2</sup>. Using As<sub>2</sub><sup>+</sup>, however, the amorphization threshold is reduced to an atomic arsenic dose less than 0.5×10<sup>14</sup> cm<sup>-2</sup>. Despite these rather significant differences in the as-implanted damage from monomers and dimers, the diffusion and dopant activation of arsenic are found to be identical following spike-annealing for ultra-shallow junction formation.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"358 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126690713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Kase, T. Kubo, Keiji Watanabe, K. Okabe, H. Nakao
{"title":"Implanted-ion dose variation from Si surface status of sub-nm scale on 90 nm ULSI process","authors":"M. Kase, T. Kubo, Keiji Watanabe, K. Okabe, H. Nakao","doi":"10.1109/IIT.2002.1257931","DOIUrl":"https://doi.org/10.1109/IIT.2002.1257931","url":null,"abstract":"To make a shallow junction, understanding the influence of the Si surface status is quite important to achieve stable-dose implanted layers. The causes or dose variation can be a sub-nm screening/capping oxide and silicon loss, which originate from the wet chemical processes, the photo resist processes and the clean room environment. These phenomena are examined using SIMS, sheet resistance and the transistor characteristics of a 90 nm node of high end CMOS logic device.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125599468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimizing implanter vacuum performance with various cassette materials","authors":"M. Evans, J. O’Neil, B. Komma","doi":"10.1109/IIT.2002.1258054","DOIUrl":"https://doi.org/10.1109/IIT.2002.1258054","url":null,"abstract":"IC manufacturers will often adopt new cassette materials for particulate control, dimensional stability, and improved thermal properties. In order to maintain tool performance, in some cases the introduction of these new materials introduce new demands on the vacuum system. Six cassette materials have been tested in a medium current implanter using eight pump configurations. The results show that preventing water in the load lock from getting to the process chamber is important to maximize tool throughput. This paper discusses what options are currently available to compensate for new vacuum demands that are related to hygroscopic cassette materials.","PeriodicalId":305062,"journal":{"name":"Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133966948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}