优化各种卡带材料的真空度

M. Evans, J. O’Neil, B. Komma
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引用次数: 0

摘要

集成电路制造商通常会采用新的盒式材料来控制颗粒,尺寸稳定性和改善热性能。为了保持刀具的性能,在某些情况下,这些新材料的引入对真空系统提出了新的要求。六种盒式材料已在使用八种泵配置的中电流植入器中进行了测试。结果表明,防止负载锁中的水进入工艺室是提高刀具产量的重要措施。本文讨论了哪些选项是目前可用的,以补偿新的真空要求,是有关吸湿盒材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimizing implanter vacuum performance with various cassette materials
IC manufacturers will often adopt new cassette materials for particulate control, dimensional stability, and improved thermal properties. In order to maintain tool performance, in some cases the introduction of these new materials introduce new demands on the vacuum system. Six cassette materials have been tested in a medium current implanter using eight pump configurations. The results show that preventing water in the load lock from getting to the process chamber is important to maximize tool throughput. This paper discusses what options are currently available to compensate for new vacuum demands that are related to hygroscopic cassette materials.
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