2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献_第4页

Multi-physics Modeling of a Power Electronics Package with Integrated Cooling 集成冷却电力电子封装的多物理场建模

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626501

A. Muslu, V. Smet, Y. Joshi

{"title":"Multi-physics Modeling of a Power Electronics Package with Integrated Cooling","authors":"A. Muslu, V. Smet, Y. Joshi","doi":"10.1109/THERMINIC52472.2021.9626501","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626501","url":null,"abstract":"Recent efforts have shown that the integrated cooling approach is a promising solution to dramatically increase the power density of modern power electronics systems. With the ever-increasing demand in various industries, the overall size and cost of power electronics packages need to be minimized with multi-functional components. Thus, this study focuses on a novel integrated packaging concept for SiC MOSFET-based power modules, with expanded functionality of package components. Considering multiple trade-offs in design, the benefits of the proposed integrated approach are explored over a standard package solution in a multi-physics modeling environment. Results show that maximum stress in devices and maximum strain in joints can be significantly reduced by 58.4% and 50.0%, respectively, compared to the standard package solution. Parasitic inductance of 1.6 nH can be achieved with optimal design of electrical busbars if special care is given to the maximum electric field and minimum allowable feature sizes in design. Moreover, Joule heating effect should be addressed in miniaturized structures if the electrical input current exceeds a critical level at the electrical busbars. Overall, integrated packaging with multi-functional terminals offers superior performance over standard packaging solutions. With the understanding of the package behavior, main challenges are discussed to guide multi-physics-based design efforts in future studies.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130272260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Impact of ambient temperature influences on the cooling performance of heat sinks under forced air convection 强迫空气对流条件下环境温度对散热器冷却性能的影响

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626504

R. Schacht, T. Nowak

引用次数: 0

In-Situ Degradation Monitoring of Sputtered Thin Al Films on Si Cantilevers Inside SEM During Accelerated Stress Testing using Nano-Indenter Actuation and Vibration Loading 纳米压头驱动和振动加载加速应力测试中Si悬臂梁上溅射铝薄膜的原位退化监测

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626510

N. Jöhrmann, V. Osipova, S. Breitenreiner, R. Pufall, B. Wunderle

{"title":"In-Situ Degradation Monitoring of Sputtered Thin Al Films on Si Cantilevers Inside SEM During Accelerated Stress Testing using Nano-Indenter Actuation and Vibration Loading","authors":"N. Jöhrmann, V. Osipova, S. Breitenreiner, R. Pufall, B. Wunderle","doi":"10.1109/THERMINIC52472.2021.9626510","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626510","url":null,"abstract":"Aluminium is still one of the most important contact metallisation for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting dedicated test specimens to standardised stress tests as e.g. thermal cycling. This paper builds on previous work about a method for accelerated stress testing and lifetime modelling of thin aluminium films i n t he high-cycle fatigue regime by isothermal mechanical loads using Si MEMS cantilevers as sample carriers. The main focus is on In-situ fatiguing performed inside a scanning electron microscope (SEM) using a nanoindenter (NI), to gain further insight into the development of degradation of the thin aluminium over time. Surface roughness of the fatigued films was previously measured via atomic force microscopy (AFM) as a failure parameter. This was motivated within a physics-of-failure based reliability paradigm by comparison with eqv. plastic strain obtained from finite element simulations, which show a relation between surface roughness and the cumulated plastic strain. Additional to AFM-measurements we present a similar approach using SEM images and compare them with finite e lement simulations.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127765145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Study of aging time effect on the EMI evolution of power RF LDMOS transistor in DC-DC buck converter circuit 老化时间对DC-DC降压变换器中功率RF LDMOS晶体管电磁干扰演化的影响研究

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626500

M. Tlig, M. A. Belaïd

引用次数: 0

Reliability of SAC+ Solders for LED Packages LED封装SAC+焊料的可靠性

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626502

G. Elger, M. Schmid

{"title":"Reliability of SAC+ Solders for LED Packages","authors":"G. Elger, M. Schmid","doi":"10.1109/THERMINIC52472.2021.9626502","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626502","url":null,"abstract":"Thermo-mechanical reliability is one major issues in solid state lighting industry which is currently still not solved satisfyingly for automotive applications. Mismatches in the coefficients of thermal expansion (CTE) between high-power LEDs packages and the printed circuit board, typically aluminum IMS (Al-IMS), in combination with high operation temperature and large temperature changes cause thermomechanical fatigue of the solder joints. The cracks in the solder joint results in an increase of the junction temperature and thus a reduction in lifetime and a decrease in light output. The LED package manufacturer optimize the packages for thermal performance and reliability. Improved SAC+ solders potentially increase reliability and reduce crack growth. A lager reliability study is performed including a total of 1800 LEDs, segmented by nine LED types and five SAC+ solder pastes. The effectiveness of the metallurgical modifications of different SAC+ solders is investigated. The LEDs are soldered on Al-IMS. To analyze the package design dependency different LED packages, e.g. ceramic and lead frame LEDs are included in the study. Quality inspections is performed by transient thermal analysis (TTA), scanning acoustic microscopy (SAM) and Xray. The initial thermal resistance of the LED modules and packages were separated by applying the dual thermal interface method. For most LED packages good agreement with the Rth in data sheets could be found but also incorrect data sheets are identified. The crack formation in the solder joints during temperature shock tests (-40 °C/125 °C, 30 minutes dwell time) is tracked by TTA measurement and SAM. First of all, it could be proven that in high stress applications the most important parameter is the silver content of the solder. Second, in the high stress application the high silver containing SAC308+SbBiNi (also called Innolot) performs best. However, for low stress lead frame packages the SAC105 performs still sufficient after the presently reached 500 cycles.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"351 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124440265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

AI-TWILIGHT: AI-digital TWIn for LIGHTing – a new European project AI-TWILIGHT: AI-digital TWIn for LIGHTing——一个新的欧洲项目

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626541

G. Martin, A. Poppe, S. Schöps, E. Kraker, C. Marty, Wouter Soer, Joan Yu

{"title":"AI-TWILIGHT: AI-digital TWIn for LIGHTing – a new European project","authors":"G. Martin, A. Poppe, S. Schöps, E. Kraker, C. Marty, Wouter Soer, Joan Yu","doi":"10.1109/THERMINIC52472.2021.9626541","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626541","url":null,"abstract":"The European industry needs to keep competitive advantage by addressing the needs for Industry 4.0 and be prepared for 5.0.Already finalized European project Delphi4LED proposed new methods and standards to generate a first of a kind multi-domain LED digital twins. Compared to traditional approach, the newly developed LED digital models contributes to reduce the design phase thanks to faster computation at equivalent accuracy.AI-TWILIGHT will generate prescriptive digital twins for the lighting industry. The project is addressing multiple application area: automotive, horticulture, streetlighting, general lighting. The ambition is to cover a large part of the lifecycle of a LED-based system (including the electronic driver): from product design flow to infrastructure development and maintenance.The key technical and exploitation objectives of the AITWILIGHT consortium are:•To create digital twins of LED light-sources and electronics (driver)•To create self-learning models using Artificial intelligence (AI) and analytics techniques•To facilitate the implementation of the digital twins in digitalized design flow (for Solid State Lighting SSL product design) and facilitate their applications upstream, up to digital twins of lighting systems of large infrastructures (e.g. for building design).•To implement the AI-TWILIGHT methods, models and tools within consortium partners to harvest its benefitsAI-TWILIGHT LED application design flows will be combined with the CPS/IoT approaches and reliability aspects, supported by AI techniques. A self-learning digital twin will be result of the project.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129111227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Comparison of Experimental and Estimated Fusing Current of Gold (Au) and Copper (Cu) Bonding Wires in Semiconductor IC Packages 半导体集成电路封装中金(Au)和铜(Cu)键合线熔断电流的实验和估计比较

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626534

R. Flauta, Zhou Zhou, H. Fan, Haibin Chen

{"title":"Comparison of Experimental and Estimated Fusing Current of Gold (Au) and Copper (Cu) Bonding Wires in Semiconductor IC Packages","authors":"R. Flauta, Zhou Zhou, H. Fan, Haibin Chen","doi":"10.1109/THERMINIC52472.2021.9626534","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626534","url":null,"abstract":"In this paper, fusing current experiments and simulation were made over a range of bonding wire diameters used in semiconductor packaging from 18-50um for Au and 23-50um for Cu. Comparing the measured fusing current for Au and Cu wires, the deviation ranged from 14-28% with largest deviation for thicker wires. This correlates well with the prediction of ~25% more current carrying capacity of Cu given its higher electrical conductivity and thermal conductivity than Au. Prediction estimates from the modified Preece equation showed 6-33% higher values when compared with the experimental results. Finite element analysis simulation under condition with both ends insulated showed 23-35% higher value than the experimental measurements for Au wire. This increased further to 35-41% under the condition with both ends connected to heat sink. For Cu wire, maximum current values from simulations were 16-33% and 38-40% higher than the experimental values under the same insulated and with heat sink configurations, respectively. The temperatures used under the condition with wire ends connected to heat sink were simulated under extreme conditions. The maximum current from the FEA simulation calculations can be used as a guideline to estimate the required number and sizes of wire that can be used for specific device and package application requirements.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130515383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Diode Based on the Spatiotemporal Modulation of Thermal Properties 基于热特性时空调制的热二极管

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626469

J. Ordonez-Miranda, Yangyu Guo, J. J. Alvarado-Gil, S. Volz, M. Nomura

引用次数: 0

Comparison of GaN HEMTs Thermal Results through different measurements methodologies: Validation with 3D simulation 通过不同测量方法比较GaN hemt的热结果:用3D模拟验证

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626486

A. Jakani, R. Sommet, Florent Gaillard, J. Nallatamby

引用次数: 3

Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure 模型阶数约简在电力电子模块线键结构可靠性预测中的应用

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626396

P. Rajaguru, M. Bella, C. Bailey

引用次数: 1