Reliability of SAC+ Solders for LED Packages

G. Elger, M. Schmid
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引用次数: 1

Abstract

Thermo-mechanical reliability is one major issues in solid state lighting industry which is currently still not solved satisfyingly for automotive applications. Mismatches in the coefficients of thermal expansion (CTE) between high-power LEDs packages and the printed circuit board, typically aluminum IMS (Al-IMS), in combination with high operation temperature and large temperature changes cause thermomechanical fatigue of the solder joints. The cracks in the solder joint results in an increase of the junction temperature and thus a reduction in lifetime and a decrease in light output. The LED package manufacturer optimize the packages for thermal performance and reliability. Improved SAC+ solders potentially increase reliability and reduce crack growth. A lager reliability study is performed including a total of 1800 LEDs, segmented by nine LED types and five SAC+ solder pastes. The effectiveness of the metallurgical modifications of different SAC+ solders is investigated. The LEDs are soldered on Al-IMS. To analyze the package design dependency different LED packages, e.g. ceramic and lead frame LEDs are included in the study. Quality inspections is performed by transient thermal analysis (TTA), scanning acoustic microscopy (SAM) and Xray. The initial thermal resistance of the LED modules and packages were separated by applying the dual thermal interface method. For most LED packages good agreement with the Rth in data sheets could be found but also incorrect data sheets are identified. The crack formation in the solder joints during temperature shock tests (-40 °C/125 °C, 30 minutes dwell time) is tracked by TTA measurement and SAM. First of all, it could be proven that in high stress applications the most important parameter is the silver content of the solder. Second, in the high stress application the high silver containing SAC308+SbBiNi (also called Innolot) performs best. However, for low stress lead frame packages the SAC105 performs still sufficient after the presently reached 500 cycles.
LED封装SAC+焊料的可靠性
热机械可靠性是固态照明行业的一个主要问题,目前在汽车应用中仍未得到满意的解决。大功率led封装与印刷电路板(通常是铝IMS (Al-IMS))之间的热膨胀系数(CTE)不匹配,再加上工作温度高和温度变化大,导致焊点的热机械疲劳。焊点上的裂纹导致结温的升高,从而导致寿命的缩短和光输出的减少。LED封装制造商优化封装的热性能和可靠性。改进的SAC+焊料有可能提高可靠性并减少裂纹扩展。一项更大的可靠性研究包括总共1800个LED,分为9种LED类型和5种SAC+焊膏。研究了不同SAC+钎料的冶金改性效果。led是焊接在Al-IMS上的。为了分析封装设计的依赖性,研究中包括了不同的LED封装,例如陶瓷和引脚框架LED。通过瞬态热分析(TTA)、扫描声学显微镜(SAM)和x射线进行质量检查。采用双热界面法分离LED模组和封装的初始热阻。对于大多数LED封装,可以在数据表中找到与Rth的良好一致,但也可以识别不正确的数据表。在温度冲击试验(-40°C/125°C, 30分钟的停留时间)中,焊点的裂纹形成通过TTA测量和SAM进行跟踪。首先,可以证明在高应力应用中最重要的参数是焊料的银含量。其次,在高应力应用中,含SAC308+SbBiNi(也称为Innolot)的高银性能最好。然而,对于低应力引线框架封装,SAC105在目前达到500次循环后仍然足够。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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