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2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献

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Multiphysics Reduced Order Modelling of a Packaged Laser Diode 封装激光二极管的多物理场降阶建模
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626505
G. Grosso, T. Moldaschl, R. Fuger, A. Binder
{"title":"Multiphysics Reduced Order Modelling of a Packaged Laser Diode","authors":"G. Grosso, T. Moldaschl, R. Fuger, A. Binder","doi":"10.1109/THERMINIC52472.2021.9626505","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626505","url":null,"abstract":"In this work a Quantum Well (QW) Laser Diode is used as a powerful light source for automotive LIDAR applications, where high power densities and short pulsations are required. Because of the extreme working conditions, a proper electrical and thermal design requires a deep understanding of the coupled electrical and thermal phenomena occurring inside the device. In this respect, multi-physics simulations are proposed in the present work as a fundamental tool to analyse the system behaviour. Because of the high computational cost of two-way coupled three-dimensional electrical and thermal FEM simulations, model order reduction is presented here as a valid alternative, providing accurate results in much shorter computational times.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116195554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TONIC: TOol for Nonlinear BCI CTMs of Integrated Circuits 集成电路的非线性BCI CTMs工具
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626527
L. Codecasa, D. D’Amore, V. d’Alessandro
{"title":"TONIC: TOol for Nonlinear BCI CTMs of Integrated Circuits","authors":"L. Codecasa, D. D’Amore, V. d’Alessandro","doi":"10.1109/THERMINIC52472.2021.9626527","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626527","url":null,"abstract":"A Nonlinear Model Order Reduction approach is proposed allowing extracting Nonlinear Boundary Condition Independent (BCI) Compact Thermal Models (CTMs) of electronic components and packaging, which take into account the dependence of thermal properties on temperature. Such approach, implemented in the code TONIC, for the first time allows automatically and efficiently extracting very accurate BCI CTMs, modeling heat conduction problems also with high levels of nonlinearity.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123778094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Rapid Failure Analysis of Installed LED Luminaire Through Standardized Processes 通过标准化流程快速分析已安装LED灯具的故障
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/THERMINIC52472.2021.9626528
J. Hegedüs, G. Hantos, P. Szabó, A. Poppe
{"title":"Rapid Failure Analysis of Installed LED Luminaire Through Standardized Processes","authors":"J. Hegedüs, G. Hantos, P. Szabó, A. Poppe","doi":"10.1109/THERMINIC52472.2021.9626528","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626528","url":null,"abstract":"Market competition, human and economic expectations fundamentally determine today’s technical products. In the development of electronic devices, an attractive exterior is now almost as an important requirement as the technical content itself. Expanding the available features, improving product-specific efficiencies, more favorable customer prices and, of course, increasing reliability are also key considerations; however, the latter does not always change in the expected direction.In this paper, we present a complex test procedure for discovering the causes of lifetime problems encountered in a recently \"LEDified\" lighting system of an office building, along with all measurement and computer-aided modeling and simulation methods that can be used to uncover thermal related issues in LED luminaires. Non-contact methods such as visual, infrared and luminance measurements, computer aided thermal simulations, laboratory and in-situ measurements based on thermal transient testing were used, many of them developed in the prior Delphi4LED H2020 ECSEL project.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129068866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
THERMINIC 2021 Table of contents THERMINIC 2021目录
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI: 10.1109/therminic52472.2021.9626515
{"title":"THERMINIC 2021 Table of contents","authors":"","doi":"10.1109/therminic52472.2021.9626515","DOIUrl":"https://doi.org/10.1109/therminic52472.2021.9626515","url":null,"abstract":"","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116661200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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