{"title":"Multiphysics Reduced Order Modelling of a Packaged Laser Diode","authors":"G. Grosso, T. Moldaschl, R. Fuger, A. Binder","doi":"10.1109/THERMINIC52472.2021.9626505","DOIUrl":null,"url":null,"abstract":"In this work a Quantum Well (QW) Laser Diode is used as a powerful light source for automotive LIDAR applications, where high power densities and short pulsations are required. Because of the extreme working conditions, a proper electrical and thermal design requires a deep understanding of the coupled electrical and thermal phenomena occurring inside the device. In this respect, multi-physics simulations are proposed in the present work as a fundamental tool to analyse the system behaviour. Because of the high computational cost of two-way coupled three-dimensional electrical and thermal FEM simulations, model order reduction is presented here as a valid alternative, providing accurate results in much shorter computational times.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC52472.2021.9626505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this work a Quantum Well (QW) Laser Diode is used as a powerful light source for automotive LIDAR applications, where high power densities and short pulsations are required. Because of the extreme working conditions, a proper electrical and thermal design requires a deep understanding of the coupled electrical and thermal phenomena occurring inside the device. In this respect, multi-physics simulations are proposed in the present work as a fundamental tool to analyse the system behaviour. Because of the high computational cost of two-way coupled three-dimensional electrical and thermal FEM simulations, model order reduction is presented here as a valid alternative, providing accurate results in much shorter computational times.