2009 IEEE International Interconnect Technology Conference最新文献_第2页

Study of low resistance TSV using electroless plated copper and tungsten-alloy barrier 化学镀铜钨合金阻挡层低电阻TSV的研究

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090376

F. Inoue, T. Yokoyama, S. Tanaka, K. Yamamoto, M. Koyanagi, T. Fukushima, Z. Wang, S. Shingubara

引用次数: 3

Novel low-k SiOC (k=2.4) with superior tolerance to direct polish and ashing for advanced BEOL integration 新型低k SiOC (k=2.4)具有优越的直接抛光和灰化耐受性，用于先进的BEOL集成

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090373

N. Asami, T. Owada, S. Akiyama, N. Ohara, Y. Iba, T. Kouno, H. Kudo, S. Takesako, T. Osada, T. Kirimura, H. Watatani, A. Uedono, Y. Nara, M. Kase

引用次数: 1

Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration 磁增强电容耦合等离子体蚀刻300毫米晶圆级铜通过硅通孔制造3D逻辑集成

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090338

W. H. Teh, R. Caramto, S. Arkalgud, T. Saito, K. Maruyama, K. Maekawa

引用次数: 8

Copper contact metallization for 22 nm and beyond 22纳米及以上的铜接触金属化

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090326

S. Seo, Chih-Chao Yang, C. Yeh, B. Haran, D. Horak, S. Fan, C. Koburger, D. Canaperi, S. P. Papa Rao, F. Monsieur, A. Knorr, A. Kerber, Chao-Kun Hu, J. Kelly, T. Vo, J. Cummings, Matthew Smalleya, K. Petrillo, S. Mehta, S. Schmitz, T. Levin, Dae-gyu Park, J. Stathis, T. Spooner, V. Paruchuri, J. Wynne, D. Edelstein, D. Mcherron, B. Doris

引用次数: 6

Robust and low cost copper contact application for low power device at 32 nm-Node and beyond 坚固、低成本的铜触点应用，适用于32nm - node及以上的低功耗器件

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090325

A. Isobayashi, J. Kelly, Takeshi Watanabe, M. Fujiwara, C. Koburger, J. Maniscalco, T. Vo, S. Chiang, Ja Ren, T. Spooner, M. Takayanagi, T. Usui, K. Ishimaru

引用次数: 2

Design impact study of wiring size and barrier metal on device performance toward 22 nm-node featuring EUV lithography 面向22nm节点EUV光刻的布线尺寸和阻挡金属对器件性能的设计影响研究

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090328

N. Nakamura, Y. Takigawa, E. Soda, N. Hosoi, Y. Tarumi, H. Aoyama, Y. Tanaka, D. Kawamura, S. Ogawa, N. Oda, S. Kondo, I. Mori, S. Saito

引用次数: 8

Deposition behavior and diffusion barrier property of CVD MnOx CVD MnOx的沉积行为及扩散阻挡性能

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090386

K. Matsumoto, K. Neishi, H. Itoh, H. Sato, S. Hosaka, J. Koike

引用次数: 0

Integrated digital AV platform “UniPhier“ 综合数码影音平台“UniPhier”

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090324

S. Fujikawa

引用次数: 0

Building the human-chip interface 构建人机界面

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090332

A. Aarts, M. Bariatto, A. Fontes, H. Neves, S. Kisban, P. Ruther, J. Penders, C. Bartic, K. Verstreken, C. van Hoof

引用次数: 3

Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects 22纳米互连光抗蚀剂去除和蚀刻后残留物去除的挑战和新方法

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI: 10.1109/IITC.2009.5090397

P. Mertens, T-G. Kim, M. Claes, Q. Le, G. Vereecke, E. Kesters, S. Suhard, A. Pacco, M. Lux, K. Kenis, A. Urbanowicz, Z. Tokei, G. Beyer

引用次数: 4