A. Aarts, M. Bariatto, A. Fontes, H. Neves, S. Kisban, P. Ruther, J. Penders, C. Bartic, K. Verstreken, C. van Hoof
{"title":"构建人机界面","authors":"A. Aarts, M. Bariatto, A. Fontes, H. Neves, S. Kisban, P. Ruther, J. Penders, C. Bartic, K. Verstreken, C. van Hoof","doi":"10.1109/IITC.2009.5090332","DOIUrl":null,"url":null,"abstract":"This paper summarizes several interconnection issues related to brain-computer interfaces and neuroprosthetics. Silicon-based out-of-plane integration and interconnection to achieve partially-invasive brain-computer interfaces will be described.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Building the human-chip interface\",\"authors\":\"A. Aarts, M. Bariatto, A. Fontes, H. Neves, S. Kisban, P. Ruther, J. Penders, C. Bartic, K. Verstreken, C. van Hoof\",\"doi\":\"10.1109/IITC.2009.5090332\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper summarizes several interconnection issues related to brain-computer interfaces and neuroprosthetics. Silicon-based out-of-plane integration and interconnection to achieve partially-invasive brain-computer interfaces will be described.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090332\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090332","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper summarizes several interconnection issues related to brain-computer interfaces and neuroprosthetics. Silicon-based out-of-plane integration and interconnection to achieve partially-invasive brain-computer interfaces will be described.
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