22纳米互连光抗蚀剂去除和蚀刻后残留物去除的挑战和新方法

2009 IEEE International Interconnect Technology Conference Pub Date : 2009-06-01 DOI:10.1109/IITC.2009.5090397

P. Mertens, T-G. Kim, M. Claes, Q. Le, G. Vereecke, E. Kesters, S. Suhard, A. Pacco, M. Lux, K. Kenis, A. Urbanowicz, Z. Tokei, G. Beyer

{"title":"22纳米互连光抗蚀剂去除和蚀刻后残留物去除的挑战和新方法","authors":"P. Mertens, T-G. Kim, M. Claes, Q. Le, G. Vereecke, E. Kesters, S. Suhard, A. Pacco, M. Lux, K. Kenis, A. Urbanowicz, Z. Tokei, G. Beyer","doi":"10.1109/IITC.2009.5090397","DOIUrl":null,"url":null,"abstract":"The critical challenges of removal of post metal hard mask etch photo resist removal and post low-k etch residue removal are described. An overview of some new non-plasma based approaches is presented.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"928 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects\",\"authors\":\"P. Mertens, T-G. Kim, M. Claes, Q. Le, G. Vereecke, E. Kesters, S. Suhard, A. Pacco, M. Lux, K. Kenis, A. Urbanowicz, Z. Tokei, G. Beyer\",\"doi\":\"10.1109/IITC.2009.5090397\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The critical challenges of removal of post metal hard mask etch photo resist removal and post low-k etch residue removal are described. An overview of some new non-plasma based approaches is presented.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"928 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090397\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090397","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

描述了去除后金属硬掩膜蚀刻光抗蚀剂和后低k蚀刻残留物的关键挑战。综述了一些新的非等离子体技术。

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Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

The critical challenges of removal of post metal hard mask etch photo resist removal and post low-k etch residue removal are described. An overview of some new non-plasma based approaches is presented.

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2009 IEEE International Interconnect Technology Conference

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