IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)最新文献_第6页

Efficient and accurate extraction of frequency-dependent resistance and inductance parameters of interconnects 高效准确地提取与频率相关的互连电阻和电感参数

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819239

Wen Wang, J. Fang, Yuzhe Chen

引用次数: 1

Physical layer design of a 1.6 GB/s DRAM bus 物理层设计了1.6 GB/s的DRAM总线

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819183

A. Moncayo, S. Hindi, Ching-Chao Huang, R. Kollipara, H. Liaw, D. Nguyen, D. Perino, A. Sarfaraz, C. Yuan, M. Leddige, J. McCall, X. Moua, J. Salmon

引用次数: 8

Design rule development for microwave flip chip applications 微波倒装芯片应用的设计规则开发

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819232

D. Staiculescu, J. Laskar, J. Mather

引用次数: 18

Electronic packaging for microwave multichip modules 微波多芯片模块的电子封装

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819181

A. Piloto

引用次数: 0

Transmission link radiation: localized defect contribution 传输链路辐射:局部缺陷贡献

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819211

E. Martinod, P. Nadeau, N. Feix, M. Lalande-Guionie, A. Reineix, B. Jecko

引用次数: 0

Toward a novel planar circuit compatible silicon micromachined waveguide 一种新型兼容平面电路的硅微机械波导

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819230

James Becker, Linda P. B. Katehi

引用次数: 15

Noise verification across 3 levels of packaging hierarchy for the IBM G5/G6 mainframes 对IBM G5/G6大型机进行跨3个包装层次的噪声验证

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819185

H. Smith, S. Kuppinger, P. Venkatachalam, W. Becker

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引用次数: 4

Modeling the effects of non-linear materials in de-coupling components of digital systems 模拟非线性材料对数字系统解耦组件的影响

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819202

G. Cokkinides, B. Beker

引用次数: 5

Half-conductive coupling for chip-to-chip connections 用于芯片到芯片连接的半导电耦合

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819187

W. Pan, C. De Tandt, F. Devisch, R. Vounckx, M. Kuijk

引用次数: 1

A fast simulation method for single and coupled lossy lines with frequency-dependent parameters based on triangle impulse responses 一种基于三角形脉冲响应的含频率参数的单线和耦合有损线的快速仿真方法

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-07-01 DOI: 10.1109/EPEP.1999.819238

Zhaoqing Chen, W. Becker, G. Katopis

引用次数: 21