Design rule development for microwave flip chip applications

Abstract

This paper presents a novel approach for analysis of factors to be considered when designing a flip chip package. It includes the design of an experiment and statistical analysis of the outputs. The most significant factors are found to be, from most to least important, the length of the area where the device and the substrate overlap (referred to as conductor overlap), the bump diameter and the width of the coplanar waveguide transmission line launch. These results are valid for conductor overlaps between 300 and 500 /spl mu/m. For a lower overlap value (120 /spl mu/m), the bump height also becomes significant. The substrate thickness in the 10 to 25 mil interval is found to be statistically insignificant, and therefore can be eliminated from further analysis.