Toward a novel planar circuit compatible silicon micromachined waveguide

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819230

James Becker, Linda P. B. Katehi

引用次数: 15

Abstract

A novel, completely packaged planar-fed silicon micromachined waveguide/resonator is proposed. Simulated results for a Ka-band resonator are given, along with initial results of the required three-dimensional photolithographic patterning along sloping sidewalls.

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一种新型兼容平面电路的硅微机械波导

提出了一种新颖的、完全封装的平面馈电硅微机械波导/谐振器。给出了一个ka波段谐振腔的模拟结果，以及沿倾斜侧壁的三维光刻图形的初步结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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