用于芯片到芯片连接的半导电耦合

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819187

W. Pan, C. De Tandt, F. Devisch, R. Vounckx, M. Kuijk

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引用次数: 1

摘要

半导电层形成一个电阻网络，并被提议提供两个配套衬底之间的电互连。实验结果证明，在合理的串扰水平下，可以获得足够的导通。

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Half-conductive coupling for chip-to-chip connections

A half-conductive layer forms a resistive network and is proposed to offer electrical interconnects between two mating substrates. Experimental results prove that sufficient conduction can be obtained for signal transmission at a reasonable crosstalk level.

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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