A. Moncayo, S. Hindi, Ching-Chao Huang, R. Kollipara, H. Liaw, D. Nguyen, D. Perino, A. Sarfaraz, C. Yuan, M. Leddige, J. McCall, X. Moua, J. Salmon
{"title":"物理层设计了1.6 GB/s的DRAM总线","authors":"A. Moncayo, S. Hindi, Ching-Chao Huang, R. Kollipara, H. Liaw, D. Nguyen, D. Perino, A. Sarfaraz, C. Yuan, M. Leddige, J. McCall, X. Moua, J. Salmon","doi":"10.1109/EPEP.1999.819183","DOIUrl":null,"url":null,"abstract":"This paper describes an innovative design and modeling methodology for development of a high performance memory bus with data signaling bandwidth of up to 1.6 gigabytes per second. Data signals operate at 800 megabits per second transfer rate. The clock frequency is 400 MHz and the signal edge transition time is 200 ps. Due to the extremely high frequencies involved, overall system electrical performance must be optimized. By following the methodology outlined in this paper, good correlation was obtained between simulated and measured results.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Physical layer design of a 1.6 GB/s DRAM bus\",\"authors\":\"A. Moncayo, S. Hindi, Ching-Chao Huang, R. Kollipara, H. Liaw, D. Nguyen, D. Perino, A. Sarfaraz, C. Yuan, M. Leddige, J. McCall, X. Moua, J. Salmon\",\"doi\":\"10.1109/EPEP.1999.819183\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes an innovative design and modeling methodology for development of a high performance memory bus with data signaling bandwidth of up to 1.6 gigabytes per second. Data signals operate at 800 megabits per second transfer rate. The clock frequency is 400 MHz and the signal edge transition time is 200 ps. Due to the extremely high frequencies involved, overall system electrical performance must be optimized. By following the methodology outlined in this paper, good correlation was obtained between simulated and measured results.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819183\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819183","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes an innovative design and modeling methodology for development of a high performance memory bus with data signaling bandwidth of up to 1.6 gigabytes per second. Data signals operate at 800 megabits per second transfer rate. The clock frequency is 400 MHz and the signal edge transition time is 200 ps. Due to the extremely high frequencies involved, overall system electrical performance must be optimized. By following the methodology outlined in this paper, good correlation was obtained between simulated and measured results.