微波多芯片模块的电子封装

A. Piloto
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引用次数: 0

摘要

只提供摘要形式。包括雷达/电子扫描阵列在内的现代射频(RF)系统是mcm开始应用的电子系统。传统的雷达/射频系统通常在大约220兆赫至94千兆赫的频率上工作,分布超过8个八度。随着单片微波集成电路(MMIC)和专用集成电路(ASIC)半导体技术的发展,模拟和混合模式(模拟和数字)MCM设计在射频系统的主要领域得到了更广泛的应用。MCM设计面临的挑战是将无源和有源RF和DC组件整合到单个MCM中,以及MCM的材料,机械设计和电气性能之间的关系。随着微波半导体技术的不断发展,对模拟和混合模式mcm的各个方面的需求也将不断发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electronic packaging for microwave multichip modules
Summary form only given. Modern radio frequency (RF) systems including radar/electronically scanned arrays are electronic systems in which MCMs are beginning to be applied. Conventional radars/RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz, a spread of over eight octaves. The development of monolithic microwave integrated circuit (MMIC) and application specific integrated circuit (ASIC) semiconductor technology has given rise to wider spread usage of analog and mixed mode (analog and digital) MCM designs within the major segments of the RF system. The challenge to MCM design is the incorporation of passive and active RF and DC components within a single MCM and the relationship between the materials, mechanical design and electrical performance of the MCM. As microwave semiconductor technology continues to evolve, so shall the demand on all aspects of analog and mixed mode MCMs.
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