{"title":"微波多芯片模块的电子封装","authors":"A. Piloto","doi":"10.1109/EPEP.1999.819181","DOIUrl":null,"url":null,"abstract":"Summary form only given. Modern radio frequency (RF) systems including radar/electronically scanned arrays are electronic systems in which MCMs are beginning to be applied. Conventional radars/RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz, a spread of over eight octaves. The development of monolithic microwave integrated circuit (MMIC) and application specific integrated circuit (ASIC) semiconductor technology has given rise to wider spread usage of analog and mixed mode (analog and digital) MCM designs within the major segments of the RF system. The challenge to MCM design is the incorporation of passive and active RF and DC components within a single MCM and the relationship between the materials, mechanical design and electrical performance of the MCM. As microwave semiconductor technology continues to evolve, so shall the demand on all aspects of analog and mixed mode MCMs.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electronic packaging for microwave multichip modules\",\"authors\":\"A. Piloto\",\"doi\":\"10.1109/EPEP.1999.819181\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. Modern radio frequency (RF) systems including radar/electronically scanned arrays are electronic systems in which MCMs are beginning to be applied. Conventional radars/RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz, a spread of over eight octaves. The development of monolithic microwave integrated circuit (MMIC) and application specific integrated circuit (ASIC) semiconductor technology has given rise to wider spread usage of analog and mixed mode (analog and digital) MCM designs within the major segments of the RF system. The challenge to MCM design is the incorporation of passive and active RF and DC components within a single MCM and the relationship between the materials, mechanical design and electrical performance of the MCM. As microwave semiconductor technology continues to evolve, so shall the demand on all aspects of analog and mixed mode MCMs.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819181\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819181","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electronic packaging for microwave multichip modules
Summary form only given. Modern radio frequency (RF) systems including radar/electronically scanned arrays are electronic systems in which MCMs are beginning to be applied. Conventional radars/RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz, a spread of over eight octaves. The development of monolithic microwave integrated circuit (MMIC) and application specific integrated circuit (ASIC) semiconductor technology has given rise to wider spread usage of analog and mixed mode (analog and digital) MCM designs within the major segments of the RF system. The challenge to MCM design is the incorporation of passive and active RF and DC components within a single MCM and the relationship between the materials, mechanical design and electrical performance of the MCM. As microwave semiconductor technology continues to evolve, so shall the demand on all aspects of analog and mixed mode MCMs.