{"title":"Front Matter: Volume 12056","authors":"","doi":"10.1117/12.2643344","DOIUrl":"https://doi.org/10.1117/12.2643344","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114888745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"New era of logic technology evolution: Z-dimensional scaling","authors":"Dechao Guo","doi":"10.1117/12.2623261","DOIUrl":"https://doi.org/10.1117/12.2623261","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134635960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. Liu, Joe Lee, Nicholas A. Joy, Y. Mignot, Angélique Raley, J. Arnold, P. Biolsi
{"title":"Patterning options for post-copper metallization on EUV self-aligned double patterning method","authors":"E. Liu, Joe Lee, Nicholas A. Joy, Y. Mignot, Angélique Raley, J. Arnold, P. Biolsi","doi":"10.1117/12.2615458","DOIUrl":"https://doi.org/10.1117/12.2615458","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130524467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. Miller, I. Seshadri, T. Kang, D. Metzler, Joe Lee, S. Sieg, S. Engelmann, J. Shearer, J. Arnold, N. Felix
{"title":"Etch and patterning development for 2nm node nanosheet devices","authors":"E. Miller, I. Seshadri, T. Kang, D. Metzler, Joe Lee, S. Sieg, S. Engelmann, J. Shearer, J. Arnold, N. Felix","doi":"10.1117/12.2614316","DOIUrl":"https://doi.org/10.1117/12.2614316","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121175396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Fenger, Youngchan Kim, Ignat Moskalenko, Johnny Herrera, Alexander Drutsa
{"title":"Advances in OPC etch modeling","authors":"G. Fenger, Youngchan Kim, Ignat Moskalenko, Johnny Herrera, Alexander Drutsa","doi":"10.1117/12.2614280","DOIUrl":"https://doi.org/10.1117/12.2614280","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122554810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
D. Levko, R. Upadhyay, Kenta Suzuki, Chandrasekhar Shukla, L. Raja
{"title":"VizGlow-MPS: a multi-fidelity process simulator for fast, yet accurate, semiconductor process design and optimization","authors":"D. Levko, R. Upadhyay, Kenta Suzuki, Chandrasekhar Shukla, L. Raja","doi":"10.1117/12.2614241","DOIUrl":"https://doi.org/10.1117/12.2614241","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132173472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Z. Tao, Yisuo Li, Waikin Li, Minsoo Kim, B. Briggs, K. Devriendt, L. Teugels, F. Sebaai, C. Lorant, C. Porret, E. Rosseel, Alfonso Sepúlveda Márquez, N. Jourdan, J. Boemmels, J. Mitard, P. Matagne, E. Altamirano-Sanchez, L. Ragnarsson, Anish Dangol, D. Batuk, Gerardo Tadeo Martinez Alanis, J. Geypen, Ken'ichi Kanazawa, Testuo Izawa, M. Kakumu, K. Sakui, N. Harada
{"title":"MOL patterning challenges in scaled SRAM with vertical Surrounding Gate Transistors (SGT)","authors":"Z. Tao, Yisuo Li, Waikin Li, Minsoo Kim, B. Briggs, K. Devriendt, L. Teugels, F. Sebaai, C. Lorant, C. Porret, E. Rosseel, Alfonso Sepúlveda Márquez, N. Jourdan, J. Boemmels, J. Mitard, P. Matagne, E. Altamirano-Sanchez, L. Ragnarsson, Anish Dangol, D. Batuk, Gerardo Tadeo Martinez Alanis, J. Geypen, Ken'ichi Kanazawa, Testuo Izawa, M. Kakumu, K. Sakui, N. Harada","doi":"10.1117/12.2614772","DOIUrl":"https://doi.org/10.1117/12.2614772","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132860639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Y. Muraki, Y. Oniki, P. P. Gowda, E. Altamirano-Sanchez, H. Mertens, N. Horiguchi, F. Holsteyns, S. Kal, C. Alix, K. Kumar, A. Mosden, T. Hurd, N. Takahashi
{"title":"Highly selective isotropic chemical dry etching for gate-all-around devices: nanosheet, forksheet and complementary FETs","authors":"Y. Muraki, Y. Oniki, P. P. Gowda, E. Altamirano-Sanchez, H. Mertens, N. Horiguchi, F. Holsteyns, S. Kal, C. Alix, K. Kumar, A. Mosden, T. Hurd, N. Takahashi","doi":"10.1117/12.2613723","DOIUrl":"https://doi.org/10.1117/12.2613723","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133079350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Shurong Liang, Amol Gupta, S. Sherman, Kevin Anglin, K. Bai, Jong Chul Park
{"title":"Pattern shape engineering","authors":"Shurong Liang, Amol Gupta, S. Sherman, Kevin Anglin, K. Bai, Jong Chul Park","doi":"10.1117/12.2615043","DOIUrl":"https://doi.org/10.1117/12.2615043","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134475662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Horiguchi, B. Briggs, B. T. Chan, S. Demuynck, Maryam Hosseini, G. Mannaert, H. Mertens, Y. Oniki, S. Subramanian, Z. Tao
{"title":"Patterning challenges and opportunities in nanosheet device architectures","authors":"N. Horiguchi, B. Briggs, B. T. Chan, S. Demuynck, Maryam Hosseini, G. Mannaert, H. Mertens, Y. Oniki, S. Subramanian, Z. Tao","doi":"10.1117/12.2615984","DOIUrl":"https://doi.org/10.1117/12.2615984","url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114958398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}