紫外光自对准双图案化后铜金属化方法的图案化选择

{"title":"紫外光自对准双图案化后铜金属化方法的图案化选择","authors":"E. Liu, Joe Lee, Nicholas A. Joy, Y. Mignot, Angélique Raley, J. Arnold, P. Biolsi","doi":"10.1117/12.2615458","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Patterning options for post-copper metallization on EUV self-aligned double patterning method\",\"authors\":\"E. Liu, Joe Lee, Nicholas A. Joy, Y. Mignot, Angélique Raley, J. Arnold, P. Biolsi\",\"doi\":\"10.1117/12.2615458\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":283821,\"journal\":{\"name\":\"Advanced Etch Technology and Process Integration for Nanopatterning XI\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Etch Technology and Process Integration for Nanopatterning XI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2615458\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Etch Technology and Process Integration for Nanopatterning XI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2615458","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}