E. Miller, I. Seshadri, T. Kang, D. Metzler, Joe Lee, S. Sieg, S. Engelmann, J. Shearer, J. Arnold, N. Felix
{"title":"Etch and patterning development for 2nm node nanosheet devices","authors":"E. Miller, I. Seshadri, T. Kang, D. Metzler, Joe Lee, S. Sieg, S. Engelmann, J. Shearer, J. Arnold, N. Felix","doi":"10.1117/12.2614316","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":283821,"journal":{"name":"Advanced Etch Technology and Process Integration for Nanopatterning XI","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Etch Technology and Process Integration for Nanopatterning XI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2614316","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}