2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)最新文献_第3页

The fine pitch direct bonding technology for chip interconnection 芯片互连的小间距直接键合技术

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704527

H. Tohyama, S. Ozawa, Y. Kitayama, T. Yamashita, Y. Nakamura

{"title":"The fine pitch direct bonding technology for chip interconnection","authors":"H. Tohyama, S. Ozawa, Y. Kitayama, T. Yamashita, Y. Nakamura","doi":"10.1109/IEMTIM.1998.704527","DOIUrl":"https://doi.org/10.1109/IEMTIM.1998.704527","url":null,"abstract":"We have developed new direct bonding technology using anisotropic conductive film (ACF) connections between two chips. We applied this bonding technology in ultra fine pitch interconnections at 40 /spl mu/m between an LED array and a driver IC, and realized a minimized LED print head. The key point of direct bonding technology is assurance of connection reliability which can be improved by two important factors. One is the elastic recovery quantity of conductive particles between the connection electrodes, and the other is the adhesive strength of the chip bonding area. As a result of analysis with particular attention paid to these factors, we found two further features: (1) an elastic recovery quantity usually obtained by using soft conductive particles which was included in ACF, in the case of electrodes with variable form and hardness; (2) adhesive strength increased when accompanied with a rise in the curing temperature. We tested this technology by interconnection of 192 connection pads lined in 40 /spl mu/m pitch, and achieved good bonding reliability in temperature and relative humidity cycling tests. This new bonding technology is effective in ultra-fine pitch direct bonding, so that this technology can be widely applied to various types of device chip. In this paper, the details of the technology and the connection reliability are reported.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128833399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A study of new flip chip packaging process for diversified bump and land combination 多元碰撞与土地组合倒装晶片封装新工艺研究

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704533

H. Noro, S. Ito, M. Kuwamura, M. Mizutani

{"title":"A study of new flip chip packaging process for diversified bump and land combination","authors":"H. Noro, S. Ito, M. Kuwamura, M. Mizutani","doi":"10.1109/IEMTIM.1998.704533","DOIUrl":"https://doi.org/10.1109/IEMTIM.1998.704533","url":null,"abstract":"Flip chip packaging using plastic substrates is gaining popularity in the IC packaging market. However, the process has not been standardized as a real mass production system. We have newly developed a flip chip packaging technology using a nonconductive underfill resin sheet. The process flow of the new flip chip packaging is as follows. First, the underfill sheet is laminated to the substrate. Next, the bumped die is aligned and attached to the substrate, which is covered with the underfill sheet under appropriate heat and pressure conditions. The bumps under the die penetrate by displacing resin and eventually reach the metal land of the substrate. Finally, curing of the underfill sheet and metal connections is done. We have studied the possibility of application of this packaging technology to diversified bump and land combinations with changing underfill components and process parameters. The electrical stability under several stress test conditions such as JEDEC Level-3 and TST has been evaluated in this study. After this evaluation, we found that the packages which were built with the appropriate resin components and process parameters show good performance for all of these reliability tests, almost regardless of bump and land materials.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"423 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115929604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Flip chip bonding reliability of advanced glass ceramic chip size package 先进玻璃陶瓷芯片尺寸封装的倒装芯片键合可靠性

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704624

I. Hazeyama, K. Ikuina, M. Kimura, Y. Shimada

引用次数: 1

The future of 3D packaging 3D包装的未来

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704633

C. Val

引用次数: 5

Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates 有机基板上倒装芯片互连的各向异性导电胶膜

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704675

A. Nagai, K. Takemura, K. Isaka, O. Watanabe, K. Kojima, K. Matsuda, I. Watanabe

{"title":"Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates","authors":"A. Nagai, K. Takemura, K. Isaka, O. Watanabe, K. Kojima, K. Matsuda, I. Watanabe","doi":"10.1109/IEMTIM.1998.704675","DOIUrl":"https://doi.org/10.1109/IEMTIM.1998.704675","url":null,"abstract":"We have developed new anisotropic conductive adhesive films (ACFs) for flip-chip interconnection to organic substrates such as printed wiring boards (PWBs). In order to reduce thermal and mechanical stress and strain induced by CTE (coefficient of thermal expansion) mismatches between chip and organic substrate, the elastic modulus of the ACF adhesive resin was lowered. In addition, the ACF adhesion strength was enhanced by optimizing the adhesive resin formulation. As a result, the modified ACF in flip-chip interconnection between gold bumps of a chip and Ni/Au coated pads on an FR-4 PWB shows stable contact resistance of lower than 10 m/spl Omega/ even after exposure to various environmental tests such as a thermal cycling test (-55/spl deg/C/+125/spl deg/C, 1000 cycles) and a pressure cooker test (121/spl deg/C, 2 atm, 168 hr) following an IR reflow treatment (twice). In addition, the excellent connection reliability was confirmed by in-situ measurement of contact resistance on a thermal cycling test (-55/spl deg/C/+125/spl deg/C, 1,000 cycles) and a high temperature humidity test (85/spl deg/C/85%RH, 1,000 hr) following IR reflow treatment (twice).","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115485903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

Investigation of the popcorn phenomenon in overmolded plastic pad array carriers 叠模塑料垫阵载体爆花现象的研究

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704618

K. Terashima, T. Toyoda

{"title":"Investigation of the popcorn phenomenon in overmolded plastic pad array carriers","authors":"K. Terashima, T. Toyoda","doi":"10.1109/IEMTIM.1998.704618","DOIUrl":"https://doi.org/10.1109/IEMTIM.1998.704618","url":null,"abstract":"The overmolded plastic pad array carrier (OMPAC) is becoming a standard carrier in packaging technology. The OMPAC type surface mount package, however, has a drawback: popcorning during reflow soldering to mount to the motherboard. This phenomenon is ascribed to rapid expansion of water inside the plastic materials, which easily absorb moisture. The popcorning is readily confirmed as a delamination and/or a crack in a plastic package that reaches the outside of that package. Many studies of the package structure and assembly processes have been undertaken to eliminate the popcorn phenomenon. In this study, we investigated the raw materials to eliminate the popcorn phenomenon without changing the conventional OMPAC structure and assembly process. For the OMPAC PCB material, new materials with high glass transition temperature and/or low moisture absorption are investigated in comparison with the glass reinforced BT (bismaleimide triazine) resin most commonly used. For the mold compound, a new type of biphenyl material is studied in comparison with the customary multifunctional epoxy mold compound used. Since the popcorn phenomenon occurs between die and PCB, the die attach epoxy between them plays a very important part in the elimination of popcorning. For this purpose, we found a material with high glass transition temperature and excellent adhesive strength between die and PCB. Using this adequate combination of PCB, mold compound, and die attach epoxy, we realized an excellent package which exceeds JEDEC level 2 moisture sensitivity.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114390741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Wetting balance evaluation by SP tension method for Pb free solder paste SP张力法评价无铅锡膏的润湿平衡

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704708

S. Ogata, M. Kanai, T. Takei

引用次数: 1

Study on planarizing process for high aspect ratio via-holes using for electroplating and apply to process for Cu/polyimide multilayer substrates 电镀用高纵横比通孔的平面化工艺研究，并应用于铜/聚酰亚胺多层基板工艺

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704626

H. Tenmei, T. Yamazaki, Y. Narizuka

引用次数: 0

Chip on suspension MR head 悬挂磁流变头上的芯片

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704670

M. Shiraishi

引用次数: 0

Future waferlevel CSP packaging 未来晶圆级CSP封装

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704504

J. Simon

引用次数: 7