{"title":"3D包装的未来","authors":"C. Val","doi":"10.1109/IEMTIM.1998.704633","DOIUrl":null,"url":null,"abstract":"Trends in interconnection techniques from 2D to 3D modules are presented. Historically, the different 3D interconnection techniques have been applied to memory modules for two reasons: market forces and simplicity. The development and manufacturing of 3D modules, firstly at Thomson-CSF from 1988 and subsequently at 3D PLUS from October 1995, addressed a variety of applications, including memory modules, calculation nodes, and microsystems. These different applications and perspectives are presented in this paper.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"The future of 3D packaging\",\"authors\":\"C. Val\",\"doi\":\"10.1109/IEMTIM.1998.704633\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Trends in interconnection techniques from 2D to 3D modules are presented. Historically, the different 3D interconnection techniques have been applied to memory modules for two reasons: market forces and simplicity. The development and manufacturing of 3D modules, firstly at Thomson-CSF from 1988 and subsequently at 3D PLUS from October 1995, addressed a variety of applications, including memory modules, calculation nodes, and microsystems. These different applications and perspectives are presented in this paper.\",\"PeriodicalId\":260028,\"journal\":{\"name\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMTIM.1998.704633\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704633","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Trends in interconnection techniques from 2D to 3D modules are presented. Historically, the different 3D interconnection techniques have been applied to memory modules for two reasons: market forces and simplicity. The development and manufacturing of 3D modules, firstly at Thomson-CSF from 1988 and subsequently at 3D PLUS from October 1995, addressed a variety of applications, including memory modules, calculation nodes, and microsystems. These different applications and perspectives are presented in this paper.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
