Chip on suspension MR head

Abstract

A magnetoresistive (MR) head with the driver IC chip on a circuit integrated suspension structure has been developed. The structural characteristics of this MR head include an optimally designed circuit integrated suspension and a small bare driver IC chip with solder bumps. The driver lC chip is located very close to the MR head slider on the suspension. This structure minimizes parasitic resistance, capacitance and inductance on the lines of the suspension between the driver lC chip and the MR head slider. Higher speed magnetic write and read data rates have been achieved. This paper presents the flip chip bonding of the driver lC chip to the circuit integrated suspension. Due to the compactness of the IC assembly, we could achieve performances such as greater mechanical fly height and resonance during magnetic data seek on the hard disk, and faster electrical data rates.