2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)最新文献_第7页

Reliability investigations of printed circuit boards 印刷电路板的可靠性研究

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704628

S. Ehrler

引用次数: 4

Application of via post interconnection for build up printed circuit board 通过后互连在装配式印刷电路板中的应用

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704666

T. Kobayashi, S. Itaya, K. Ikeda, J. Kawasaki, H. Honma

{"title":"Application of via post interconnection for build up printed circuit board","authors":"T. Kobayashi, S. Itaya, K. Ikeda, J. Kawasaki, H. Honma","doi":"10.1109/IEMTIM.1998.704666","DOIUrl":"https://doi.org/10.1109/IEMTIM.1998.704666","url":null,"abstract":"Recently, printed circuit boards (PCBs) have been downsized and electronic circuits have become more dense, because of the tendency for electronic component miniaturization. With the shrinkage of PCBs, the build up process has become an important production technique in PCB preparation. For the build up technique, each of the electric circuit layers is electrically connected with via holes. The via holes are metallized by means of electroless plating and electroplating of copper. In the electroless plating process with miniaturization of via hole diameter, if the via hole deposition uniformity is decreased, the electrical reliability between the layers significantly deteriorates. Accordingly, the authors investigated build up printed circuit boards using via posts, which are metallized using the Cu electroplating method. The shear strength between electroplated via posts and electrolessly plated underlayers was evaluated. It was found that electroplated via posts with higher shear strength are obtained by optimization of the pretreatment process and electroplating conditions. In particular, it was important that oxide films on the copper underlayer were removed for improved shear strength.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129042125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fuzzy logic based thermal design for MCM placement 基于模糊逻辑的MCM散热设计

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704560

Y. Huang, S. Fu, Y. Chang

引用次数: 5

Epoxy adhesive sheet with copper foil for multiple IVH build-up technology 环氧胶粘片与铜箔多IVH建立技术

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704520

K. Kobayashi, Y. Kumashiro, A. Takahashi, K. Morita, T. Tanabe

引用次数: 1

The application of flip chip bonding technology using anisotropic conductive film to the mobile communications terminals 利用各向异性导电膜的倒装芯片键合技术在移动通信终端中的应用

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI: 10.1109/IEMTIM.1998.704531

A. Torii, M. Takizawa, M. Sawano

引用次数: 4

Application of the thermal network method to the transient thermal analysis of multichip modules 热网络法在多芯片模块暂态热分析中的应用

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1996-10-01 DOI: 10.1109/IEMTIM.1998.704549

M. Ishizuka, Y. Fukuoka

引用次数: 12

Performance of metal ball grid array (metal BGA) package 金属球栅阵列(BGA)封装性能

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1900-01-01 DOI: 10.1109/IEMTIM.1998.704502

H. Tanaka, J. Tanaka, M. Morita, H. Waki

引用次数: 0

New PTC and NTC thick film materials for gigahertz range temperature variable attenuators 用于千兆赫变温衰减器的新型PTC和NTC厚膜材料

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1900-01-01 DOI: 10.1109/IEMTIM.1998.704540

A. Feingold, P. Amstutz, R.L. Wahlers, C. Huang, S. Stein, J. Mazzochette

{"title":"New PTC and NTC thick film materials for gigahertz range temperature variable attenuators","authors":"A. Feingold, P. Amstutz, R.L. Wahlers, C. Huang, S. Stein, J. Mazzochette","doi":"10.1109/IEMTIM.1998.704540","DOIUrl":"https://doi.org/10.1109/IEMTIM.1998.704540","url":null,"abstract":"Negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thick film thermistor pastes were developed. Using these materials, cost effective temperature variable attenuators (TVA) for use up to 18 GHz are described. These devices maintain the signal level in amplifiers, switches, delay lines, and other microwave and RF signal processing devices. By combining NTC and PTC thermistors in \"T\" and \"/spl Pi/\" configurations, the attenuation changes to compensate for temperature induced signal level changes. Judicious choice of resistance and TCR yields constant impedance over the operating range, thus avoiding unwanted signal reflections. While the temperature sensitivity of NTC and PTC chip thermistors is large, their use in TVAs requires a large and expensive inventory to provide the required resistance and TCR values. Thick film thermistor systems were developed to overcome these limitations. These include an NTC materials series with TCR values as high as -500,000 ppm//spl deg/C and resistance range coverage from 100 /spl Omega//sq. to 1M /spl Omega//sq. The complimentary PTC system features linear TCR values of 3000 ppm//spl deg/C and greater with resistance values of 5-5000 /spl Omega//sq. Process variables for these new thick film thermistor materials are discussed. Attenuation and frequency curves are presented. Impedance match, as characterized by VSWR versus frequency curves are presented. Current applications include Thermopad/sup R/ type TVAs with improved high frequency performance appropriate for mobile communications and similar uses.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132910208","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0