Reliability investigations of printed circuit boards

S. Ehrler
{"title":"Reliability investigations of printed circuit boards","authors":"S. Ehrler","doi":"10.1109/IEMTIM.1998.704628","DOIUrl":null,"url":null,"abstract":"Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"55 Pt B 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.
印刷电路板的可靠性研究
只提供摘要形式。可靠性是当前印刷电路板的关键性能指标之一。本文讨论了各种PCB基材的可靠性问题。考虑了镀铜厚度、表面光洁度、宽高比的影响,以及电路板内外层连接之间可能存在的差异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信