Fuzzy logic based thermal design for MCM placement

An algorithm that perform a global placement procedure by taking into account both routability and reliability is presented in this paper. For reliability considerations, the design methodology addresses the placement of the power dissipating chips to achieve a uniform thermal distribution. Placement for routability is based on minimization of the total wire length. The placement trade-offs between routing and reliability are investigated. Our approach to the placement problem is based on the modified force-directed placement method. The proposed thermal force-directed placement method relates the force equations to the power dissipation values of the individual bare chips. Examples of multichip placement are presented. The finite element simulation results show that our approach can obtain better a thermal distribution than other traditional placement methods.