印刷电路板的可靠性研究

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI:10.1109/IEMTIM.1998.704628

S. Ehrler

{"title":"印刷电路板的可靠性研究","authors":"S. Ehrler","doi":"10.1109/IEMTIM.1998.704628","DOIUrl":null,"url":null,"abstract":"Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"55 Pt B 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Reliability investigations of printed circuit boards\",\"authors\":\"S. Ehrler\",\"doi\":\"10.1109/IEMTIM.1998.704628\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.\",\"PeriodicalId\":260028,\"journal\":{\"name\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"volume\":\"55 Pt B 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMTIM.1998.704628\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

只提供摘要形式。可靠性是当前印刷电路板的关键性能指标之一。本文讨论了各种PCB基材的可靠性问题。考虑了镀铜厚度、表面光洁度、宽高比的影响，以及电路板内外层连接之间可能存在的差异。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reliability investigations of printed circuit boards

Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered.

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来源期刊

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)

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