Wetting balance evaluation by SP tension method for Pb free solder paste

Abstract

Recent studies have provided Pb-free solder and soldering technology for use in electronic assemblies for interconnections in order to avoid water pollution due to the Pb in Sn-Pb solder. Pb-free solder characteristics must be evaluated rapidly and exactly for use in real products. This paper describes a new evaluation method for the wetting balance test of Pb-free solder alloys for use in reflow soldering processes.