SP张力法评价无铅锡膏的润湿平衡

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI:10.1109/IEMTIM.1998.704708

S. Ogata, M. Kanai, T. Takei

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引用次数: 1

摘要

为了避免锡铅焊料中的铅对水的污染，近年来的研究提供了用于电子组件互连的无铅焊料和焊接技术。为了在实际产品中使用，必须快速准确地评估无铅焊料的特性。本文介绍了一种用于回流焊工艺的无铅钎料合金润湿平衡试验的新评价方法。

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Wetting balance evaluation by SP tension method for Pb free solder paste

Recent studies have provided Pb-free solder and soldering technology for use in electronic assemblies for interconnections in order to avoid water pollution due to the Pb in Sn-Pb solder. Pb-free solder characteristics must be evaluated rapidly and exactly for use in real products. This paper describes a new evaluation method for the wetting balance test of Pb-free solder alloys for use in reflow soldering processes.

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来源期刊

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)

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