Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)最新文献

The design and implementation of NASA's advanced flight computing module NASA先进飞行计算模块的设计与实现

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-03-15 DOI: 10.1109/MCMC.1995.512001

L. Alkalaj, B. Jarvis

引用次数: 10

Wire width optimization of transmission lines for low power design 面向低功耗设计的输电线路线宽优化

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512015

Rohinish Gupta, J. Willis, L. Pillage

引用次数: 1

Efficient modeling and simulation of coupled transmission lines 耦合传输线的高效建模与仿真

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512019

E. C. Chang, S. Kang

引用次数: 2

Avoiding dispersion in distributed RLC lines by shaping 通过整形避免分布式RLC线路中的色散

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512013

J. Roychowdhury

引用次数: 5

A silicon-on-silicon MCM for voice recognition/telephone answering device 一种用于语音识别/电话应答装置的硅对硅MCM

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512002

B. J. Han, S. Das, R. Frye, K. Tai, M. Lau

引用次数: 4

A unified approach to chip, test, and assembly technologies for MCMs mcm芯片、测试和组装技术的统一方法

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512031

D. Bartelink

引用次数: 2

Sensitivity analysis of interconnect networks based on S-parameter macromodel 基于s参数宏模型的互联网络灵敏度分析

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512009

Yanhua Sun, W. Dai

{"title":"Sensitivity analysis of interconnect networks based on S-parameter macromodel","authors":"Yanhua Sun, W. Dai","doi":"10.1109/MCMC.1995.512009","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512009","url":null,"abstract":"In this paper a simple and efficient approach for time domain sensitivity analysis is presented. Since moments of the Taylor series of a function are derivatives of the function to frequency, the same technique can be used to compute sensitivities. The basic elements in the linear networks are described by their S-parameters and the first derivatives to parameter variations of the S-parameter; which are expressed as Taylor series. A linear network is reduced to an S-parameter based macromodel together with the driving sources and the nodes of interest. The network transfer functions together with their sensitivities with respect to all the parameter variations can be obtained in one pass during the network reduction process. Since the number of external nodes are much less than the total number of nodes in the network, this method is very efficient The method can be extended to compute the second or higher order sensitivities, which are very difficult, if not impossible, for other known methods. Experimental results show that this method is robust and efficient. This method is very useful for performance optimization, especially when the number of design variables and number of specifications are very large.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121634103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs 在mcm加速测试中解决器件可靠性的物理故障(POF)方法

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.511998

J. Evans, M. Cushing, P. Lall, R. Bauernschub

引用次数: 16

Thermosonic bonding for flip-chip assembly 用于倒装芯片组装的热声键合

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512007

S. Kang, T. McLaren, Wenge Zhang, Y.C. Lee

引用次数: 22

A novel 2-sided multi-chip-module used to create a 50,000 gate programmable logic device 一种新型的双面多芯片模块，用于创建50,000门可编程逻辑器件

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512004

R. Terrill

引用次数: 4