A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs

Abstract

The physics-of-failure testing approach for multichip modules presented in this paper determines test levels based on failure mechanisms, failure modes, and stresses for the application. It uses quantitative failure models and acceleration transforms and adapts the knowledge of dominant failure mechanisms to the selection of accelerating stress parameters. The stress levels, designed specifically for each test article, are based on manufacturing processes, geometry, and materials.