{"title":"NASA先进飞行计算模块的设计与实现","authors":"L. Alkalaj, B. Jarvis","doi":"10.1109/MCMC.1995.512001","DOIUrl":null,"url":null,"abstract":"This paper describes the first MCM module of the AFC program which implements the functionality of a 32-bit RISC radiation hardened space flight computer. This module was designed jointly by engineers at JPL and TRW using a collaborative partnership agreement. The MCM was fabbed at nCHIP Corporation. The AFC program also plans to design, develop, and fab two more MCM modules: the Mass Memory MCM, and Programmable I/O MCM. These three MCMs will then be stacked as part of a scalable (stackable) core avionics architecture. The flight computer MCM described in this pager contains 33 die in a single 2 by 4 inch AlN package from Coors, with a total of 442 pins. The MCM uses nCHIP's die stack approach for both SRAM and EEPROM.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"The design and implementation of NASA's advanced flight computing module\",\"authors\":\"L. Alkalaj, B. Jarvis\",\"doi\":\"10.1109/MCMC.1995.512001\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the first MCM module of the AFC program which implements the functionality of a 32-bit RISC radiation hardened space flight computer. This module was designed jointly by engineers at JPL and TRW using a collaborative partnership agreement. The MCM was fabbed at nCHIP Corporation. The AFC program also plans to design, develop, and fab two more MCM modules: the Mass Memory MCM, and Programmable I/O MCM. These three MCMs will then be stacked as part of a scalable (stackable) core avionics architecture. The flight computer MCM described in this pager contains 33 die in a single 2 by 4 inch AlN package from Coors, with a total of 442 pins. The MCM uses nCHIP's die stack approach for both SRAM and EEPROM.\",\"PeriodicalId\":223500,\"journal\":{\"name\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1995.512001\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The design and implementation of NASA's advanced flight computing module
This paper describes the first MCM module of the AFC program which implements the functionality of a 32-bit RISC radiation hardened space flight computer. This module was designed jointly by engineers at JPL and TRW using a collaborative partnership agreement. The MCM was fabbed at nCHIP Corporation. The AFC program also plans to design, develop, and fab two more MCM modules: the Mass Memory MCM, and Programmable I/O MCM. These three MCMs will then be stacked as part of a scalable (stackable) core avionics architecture. The flight computer MCM described in this pager contains 33 die in a single 2 by 4 inch AlN package from Coors, with a total of 442 pins. The MCM uses nCHIP's die stack approach for both SRAM and EEPROM.