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Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)最新文献

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Experimental characterization of simultaneous switching noise for multichip module 多芯片模块同步开关噪声的实验表征
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512030
Kenji Ito, Katsuto Kato, N. Hirano, Toshio Sudo
{"title":"Experimental characterization of simultaneous switching noise for multichip module","authors":"Kenji Ito, Katsuto Kato, N. Hirano, Toshio Sudo","doi":"10.1109/MCMC.1995.512030","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512030","url":null,"abstract":"CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131993961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Examination of high frequency dielectric properties of thin film polymers using an in-situ resonant technique 用原位共振技术检测薄膜聚合物的高频介电特性
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512032
K. G. Laursen, D. Hertling, T. Hodge, S. Bidstrup, P. Kohl
{"title":"Examination of high frequency dielectric properties of thin film polymers using an in-situ resonant technique","authors":"K. G. Laursen, D. Hertling, T. Hodge, S. Bidstrup, P. Kohl","doi":"10.1109/MCMC.1995.512032","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512032","url":null,"abstract":"Using an on-wafer resonant technique the high frequency dielectric properties of six thin film polymers are measured in the range from 1 GHz to 9 GHz. Comparisons are made between the high frequency and low frequency values of the dielectric constant. The effects of different cure conditions and metallizations are also examined.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133878481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
System design optimization for MCM MCM系统设计优化
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512017
P. Franzon, A. Stanaski, Y. Tekmen, Sanjeev Banerjai
{"title":"System design optimization for MCM","authors":"P. Franzon, A. Stanaski, Y. Tekmen, Sanjeev Banerjai","doi":"10.1109/MCMC.1995.512017","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512017","url":null,"abstract":"Many performance/cost advantages can be gained if a chip-set is optimally redesigned to take advantage of the high wire density, fast interconnect delays, and high pin-counts available in MCM-D/flip-chip technology. Examples are given showing for what conditions the cost of the system can be reduced through chip partitioning and how the performance/cost of a computer core can be increased by 81%.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"161 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131182222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Cost effective small via generation-the laser solution 成本效益小，通过产生激光解决方案
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512029
B. Gu, J. Morrison
{"title":"Cost effective small via generation-the laser solution","authors":"B. Gu, J. Morrison","doi":"10.1109/MCMC.1995.512029","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512029","url":null,"abstract":"In today's electronics packaging industry, the choice of the technologies of generating smaller vias remains undetermined. Laser drilling is one of the most promising among all small via generation technologies. However, historically laser processing has been viewed as an expensive and slow process. We recently reported a cost effective small via drilling process based on a modified TEA CO/sub 2/ laser. The field test showed the process was reliable and cost effective. The new results from more in-depth experiments are presented in this paper along with the comparison among various laser drilling technologies.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116712063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
An automatic network generator for design verification of electronic packages 用于电子封装设计验证的自动网络生成器
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI: 10.1109/MCMC.1995.512011
N. Cherukuri, J. Prince
{"title":"An automatic network generator for design verification of electronic packages","authors":"N. Cherukuri, J. Prince","doi":"10.1109/MCMC.1995.512011","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512011","url":null,"abstract":"The design and development of a non-manhattan multi-layered layout extractor is discussed. The tool extracts a physical database in DXF format and generates a SPICE compatible deck after accounting for discontinuities like bends, vias etc. and transmisson line effects in interconnects. Algorithms for identifying discontinuities and multi-conductor transmission line systems (MTLs) are presented. A model library architecture which provides the electrical models of frequently encountered geometric structures is briefly discussed. Extraction time for a typical single chip package on various hardware platforms is reported. The circuit equivalent of a sample structure, as interpreted by the program, is presented. A graphical user interface which aids in manual decomposition and verification of the package is briefly discussed.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126639035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimal transient simulation of distributed lines 分布式线路的优化暂态仿真
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1900-01-01 DOI: 10.1109/MCMC.1995.512021
D. Kuznetsov, J. Schutt-Ainé, R. Mittra
{"title":"Optimal transient simulation of distributed lines","authors":"D. Kuznetsov, J. Schutt-Ainé, R. Mittra","doi":"10.1109/MCMC.1995.512021","DOIUrl":"https://doi.org/10.1109/MCMC.1995.512021","url":null,"abstract":"This paper summarizes the application of the optimal method to the simulation of uniform distributed lines. The method combines indirect numerical integration with the open-loop device model for distributed lines. The optimal method results in maximum efficiency, accuracy and practical applicability for the transient analysis of digital circuits. The optimal line model can be directly used in a circuit simulator, and lines can be characterized with frequency- or time-domain data samples. The efficiency of the optimal method makes possible an accurate simulation of real circuits, containing thousands of multiconductor nonuniform frequency-dependent lines and nonlinear active devices, with virtually no increase in the simulation time compared to that for the simple replacement of interconnects with lumped resistors.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126851526","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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