用原位共振技术检测薄膜聚合物的高频介电特性

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) Pub Date : 1995-01-31 DOI:10.1109/MCMC.1995.512032

K. G. Laursen, D. Hertling, T. Hodge, S. Bidstrup, P. Kohl

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引用次数: 2

摘要

采用片上谐振技术测量了6种薄膜聚合物在1ghz ~ 9ghz范围内的高频介电特性。对介电常数的高频值和低频值进行了比较。还考察了不同的固化条件和金属化的影响。

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Examination of high frequency dielectric properties of thin film polymers using an in-situ resonant technique

Using an on-wafer resonant technique the high frequency dielectric properties of six thin film polymers are measured in the range from 1 GHz to 9 GHz. Comparisons are made between the high frequency and low frequency values of the dielectric constant. The effects of different cure conditions and metallizations are also examined.

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Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)

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